XC3S1200E-4FTG256I -Internet of Things -Medical Equipment

XC3S1200E-4FTG256I ApplicationField

-Wireless Technology
-Artificial Intelligence
-Cloud Computing
-Industrial Control
-Consumer Electronics
-Medical Equipment
-5G Technology
-Internet of Things

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XC3S1200E-4FTG256I FAQ Chips 

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: Where can I purchase Xilinx XC3S1200E Development Boards, Evaluation Boards, or Spartan-3E FPGA Starter Kit? also provide technical information?
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Q: How to obtain XC3S1200E-4FTG256I technical support documents?
A: Enter the “XC3S1200E-4FTG256I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

ICs XC3S1200E-4FTG256I Features

and RSDS
– Fast look-ahead carry logic
– Dedicated 18 x 18 multipliers
– Wide multiplexers
– Double Data Rate (DDR) support
– High-resolution phase shifting
– Up to 432 Kbits of total distributed RAM
– Up to 633 I/O pins
– Clock skew elimination
• Logic resources
– Eight differential signal standards including LVDS
– Frequency synthesis
– Abundant logic cells with shift register capability
– JTAG logic compatible with IEEE 1149.1/1532
• SelectRAM hierarchical memory

• Digital Clock Manager (four DCMs)
– Up to 1,728 Kbits of total block RAM
– Eighteen single-ended signal standards

• SelectIO signaling

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Xilinx XC3S1200E-4FTG256I Overview

The XC3S1200E-4FTG256I Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to 5,000,000 system gates, as shown in Datasheet.The XC3S1200E-4FTG256I ncreasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions.These XC3S1200E-4FTG256I FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S1200E-4FTG256I FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The XC3S1200E-4FTG256I is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S1200E-4FTG256I FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx Voltage regulator tube series XC3S1200E-4FTG256I is FPGA Spartan-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S1200E-4FTG256I Tags integrated circuit

1. Spartan-3E FPGA starter kit
2. XC3S1200E evaluation board
3. XC3S1200E reference design
4. XC3S1200E-4FTG256I Datasheet PDF
5. Xilinx XC3S1200E
6. Spartan-3E FPGA XC3S1200E
7. Spartan-3E FPGA evaluation kit
8. XC3S1200E development board
9. XC3S1200E-4FTG256I Datasheet PDF

Xilinx XC3S1200E-4FTG256I TechnicalAttributes

-Mounting Type Surface Mount
-Number of Logic Elements/Cells 19512
-Voltage – Supply 1.14V ~ 1.26V
-Supplier Device Package 256-FTBGA (17×17)
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of LABs/CLBs 2168
-Number of I/O 190

-Total RAM Bits 516096
-Package / Case 256-LBGA

-Number of Gates 1200000