XC3S1200E-5FTG256C ApplicationField
-Industrial Control
-Wireless Technology
-Cloud Computing
-Internet of Things
-Consumer Electronics
-Medical Equipment
-5G Technology
-Artificial Intelligence
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XC3S1200E-5FTG256C FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Where can I purchase Xilinx XC3S1200E Development Boards, Evaluation Boards, or Spartan-3E FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs XC3S1200E-5FTG256C Features
– High-resolution phase shifting
– Clock skew elimination
– JTAG logic compatible with IEEE 1149.1/1532
– Double Data Rate (DDR) support
– Eight differential signal standards including LVDS
• SelectRAM hierarchical memory
• Digital Clock Manager (four DCMs)
– Frequency synthesis
– Up to 633 I/O pins
– Dedicated 18 x 18 multipliers
– Wide multiplexers
– Abundant logic cells with shift register capability
and RSDS
– Fast look-ahead carry logic
– Up to 432 Kbits of total distributed RAM
– Eighteen single-ended signal standards
• Logic resources
– Up to 1,728 Kbits of total block RAM
• SelectIO signaling
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Xilinx XC3S1200E-5FTG256C Overview
The XC3S1200E-5FTG256C Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The eight-member family offers densities ranging from 50,000 to 5,000,000 system gates, as shown in Datasheet.The XC3S1200E-5FTG256C ncreasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions.These XC3S1200E-5FTG256C FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S1200E-5FTG256C FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The XC3S1200E-5FTG256C is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S1200E-5FTG256C FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx FPGAs series XC3S1200E-5FTG256C is 1.2M Gates 19512 Cells 657MHz 90nm (CMOS) Technology 1.2V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC3S1200E-5FTG256C Tags integrated circuit
1. Xilinx Spartan-3E FPGA development board
2. Xilinx XC3S1200E
3. Spartan-3E FPGA XC3S1200E
4. Spartan-3E FPGA starter kit
5. XC3S1200E evaluation board
6. XC3S1200E-5FTG256C Datasheet PDF
7. Spartan-3E FPGA evaluation kit
8. XC3S1200E development board
9. Spartan-3E FPGA starter kit
Xilinx XC3S1200E-5FTG256C TechnicalAttributes
-Total RAM Bits 516096
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of Logic Elements/Cells 19512
-Number of Gates 1200000
-Number of I/O 190
-Voltage – Supply 1.14V ~ 1.26V
-Supplier Device Package 256-FTBGA (17×17)
-Mounting Type Surface Mount
-Package / Case 256-LBGA
-Number of LABs/CLBs 2168
