XC3S1400A-4FGG676C -Consumer Electronics -Wireless Technology

XC3S1400A-4FGG676C ApplicationField

-Medical Equipment
-5G Technology
-Internet of Things
-Artificial Intelligence
-Industrial Control
-Wireless Technology
-Cloud Computing
-Consumer Electronics

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XC3S1400A-4FGG676C FAQ Chips 

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs XC3S1400A-4FGG676C Features

• Very low cost, high-performance logic solution for high-volume,
cost-conscious applications

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Xilinx XC3S1400A-4FGG676C Overview

The XC3S1400A-4FGG676C (FPGAs) solves the design challenges in most high-volume, cost-sensitive, I/O-intensive electronic applications.Because of their exceptionally low cost, The XC3S1400A-4FGG676C FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment.Avoid the high initial cost, lengthy development cycles, and the inherent inflexibility of conventional ASICs, and permit field design upgrades.The XC3S1400A-4FGG676C is a superior alternative to mask programmed ASICs.
The Xilinx High-frequency devices series XC3S1400A-4FGG676C is 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V , View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S1400A-4FGG676C Tags integrated circuit

1. Spartan-3A XC3S1400A
2. XC3S1400A development board
3. XC3S1400A evaluation board
4. Xilinx Spartan-3A development board
5. XC3S1400A reference design
6. Xilinx XC3S1400A
7. Spartan-3A evaluation kit
8. Spartan-3A starter kit
9. Xilinx Spartan-3A development board

Xilinx XC3S1400A-4FGG676C TechnicalAttributes

-Package / Case 676-BGA
-Number of Gates 1400000
-Total RAM Bits 589824
-Number of I/O 502
-Supplier Device Package 676-FBGA (27×27)
-Voltage – Supply 1.14V ~ 1.26V
-Number of LABs/CLBs 2816

-Mounting Type Surface Mount
-Operating Temperature 0℃ ~ 85℃ (TJ)

-Number of Logic Elements/Cells 25344