XC3S1400AN-4FG676C -Cloud Computing -Medical Equipment

XC3S1400AN-4FG676C ApplicationField

-Wireless Technology
-5G Technology
-Internet of Things
-Consumer Electronics
-Industrial Control
-Medical Equipment
-Artificial Intelligence
-Cloud Computing

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XC3S1400AN-4FG676C FAQ Chips 

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: Does the price of XC3S1400AN-4FG676C devices fluctuate frequently?
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Q: Where can I purchase Xilinx XC3S1400AN Development Boards, Evaluation Boards, or Spartan-3AN FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How to obtain XC3S1400AN-4FG676C technical support documents?
A: Enter the “XC3S1400AN-4FG676C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

ICs XC3S1400AN-4FG676C Features

• Up to 502 I/O pins or 227 differential signal pairs
• 20 years Flash memory data retention
• Integrated robust configuration memory
• Security features provide bitstream anti-cloning protection
• Fast response time, typically less than 100 μs
• Full hot-swap compliance
• MicroBlaze and PicoBlaze embedded processor cores
• DDR/DDR2 SDRAM support up to 400 Mb/s
• Unique Device DNA serial number in each device for
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
• Memory, multipliers, DCMs, SelectIO, hot swap, power management, etc.
• Flash memory sector protection and lockdown
• Fully compliant 32-/64-bit 33 MHz PCI technology support
configuration errors
• Reduces support issues
• 3.3V ±10% compatibility and hot swap compliance
• Improves ease-of-use
• Complete Xilinx ISE and WebPACK software development system support
• Low-cost QFP and BGA Pb-free (RoHS) packaging options
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Up to eight Digital Clock Managers (DCMs)
• The new standard for low cost nonvolatile FPGA solutions
• Eight global clocks and eight additional clocks per each half of device, plus abundant low-skew routing
• Plentiful amounts of nonvolatile memory available to the user
• Abundant, flexible logic resources
• Pin-compatible with the same packages in the Spartan-3A FPGA family
• Retains all design state and FPGA configuration data
• 622+ Mb/s data transfer rate per I/O
• Enhanced 18 x 18 multipliers with optional pipeline
• Embedded processing and code shadowing
• Up to 576 Kbits of dedicated block RAM
• LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL differential I/O
• Robust 100K Flash memory program/erase cycles
• MultiBoot support
• Buried configuration interface
• Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set
• Suspend mode reduces system power consumption
• Scratchpad memory
• Saves board space
• Up to 176 Kbits of efficient distributed RAM
• Up to 11+ Mb available
• Configuration watchdog timer automatically recovers from
• Simplifies design
• Multi-voltage, multi-standard SelectIO interface pins
• Up to 24 mA output drive
• Hierarchical SelectRAM memory architecture
design Authentication to prevent unauthorized copying
• Optional shift register or distributed RAM support
• Densities up to 25,344 logic cells

Request XC3S1400AN-4FG676C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

Xilinx XC3S1400AN-4FG676C Overview

The XC3S1400AN-4FG676C combines the best attributes of a
leading edge, low cost FPGA with nonvolatile technology across a
broad range of densities. The family combines all the features of
the Spartan-3A FPGA family plus leading technology in-system
Flash memory for configuration and nonvolatile data storage.
The Spartan-3AN FPGAs are part of the Extended Spartan-3A
family, which also includes the Spartan-3A FPGAs and the higher
density Spartan-3A DSP FPGAs. The Spartan-3AN FPGA family
is excellent for space-constrained applications such as blade
servers, medical devices, automotive infotainment, telematics,
GPS, and other small consumer products. Combining FPGA and
Flash technology minimizes chip count, PCB traces and overall
size while increasing system reliability.
The XC3S1400AN-4FG676C internal configuration interface is
completely self-contained, increasing design security. The family
maintains full support for external configuration. The XC3S1400AN  is the world’s first nonvolatile FPGA with MultiBoot,
supporting two or more configuration files in one device, allowing
alternative configurations for field upgrades, test modes, or
multiple system configurations.
The Xilinx FPGAs (Field Programmable Gate Array) series XC3S1400AN-4FG676C is Spartan-3A FPGA 502 I/O 676FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S1400AN-4FG676C Tags integrated circuit

1. XC3S1400AN reference design
2. Spartan-3AN FPGA XC3S1400AN
3. XC3S1400AN-4FG676C Datasheet PDF
4. Spartan-3AN FPGA starter kit
5. XC3S1400AN development board
6. Xilinx Spartan-3AN FPGA development board
7. Xilinx XC3S1400AN
8. XC3S1400AN evaluation board
9. Spartan-3AN FPGA starter kit

Xilinx XC3S1400AN-4FG676C TechnicalAttributes

-Number of Logic Elements/Cells 25344
-Supplier Device Package 676-FCBGA (27×27)
-Number of I/O 502
-Mounting Type Surface Mount
-Package / Case 676-BBGA, FCBGA
-Voltage – Supply 1.14V ~ 1.26V
-Number of Gates 1400000

-Operating Temperature 0℃ ~ 85℃ (TJ)
-Total RAM Bits 589824

-Number of LABs/CLBs 2816