XC3S1400AN-4FG676I -5G Technology -Cloud Computing

XC3S1400AN-4FG676I ApplicationField

-Consumer Electronics
-Internet of Things
-Wireless Technology
-Artificial Intelligence
-Medical Equipment
-Cloud Computing
-Industrial Control
-5G Technology

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XC3S1400AN-4FG676I FAQ Chips 

Q: Does the price of XC3S1400AN-4FG676I devices fluctuate frequently?
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Q: Where can I purchase Xilinx XC3S1400AN Development Boards, Evaluation Boards, or Spartan-3AN FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: How to obtain XC3S1400AN-4FG676I technical support documents?
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ICs XC3S1400AN-4FG676I Features

• Up to 24 mA output drive
• Suspend mode reduces system power consumption
• Integrated robust configuration memory
• MultiBoot support
• Up to 576 Kbits of dedicated block RAM
• Enhanced 18 x 18 multipliers with optional pipeline
• Flash memory sector protection and lockdown
• Simplifies design
• Optional shift register or distributed RAM support
• Fast response time, typically less than 100 μs
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
• MicroBlaze and PicoBlaze embedded processor cores
• Robust 100K Flash memory program/erase cycles
• 3.3V ±10% compatibility and hot swap compliance
• Saves board space
• DDR/DDR2 SDRAM support up to 400 Mb/s
• Up to 11+ Mb available
• Up to eight Digital Clock Managers (DCMs)
• Up to 502 I/O pins or 227 differential signal pairs
• Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set
• Eight global clocks and eight additional clocks per each half of device, plus abundant low-skew routing
• Memory, multipliers, DCMs, SelectIO, hot swap, power management, etc.
• Fully compliant 32-/64-bit 33 MHz PCI technology support
design Authentication to prevent unauthorized copying
• Hierarchical SelectRAM memory architecture
• The new standard for low cost nonvolatile FPGA solutions
• Retains all design state and FPGA configuration data
• Complete Xilinx ISE and WebPACK software development system support
• Pin-compatible with the same packages in the Spartan-3A FPGA family
• Up to 176 Kbits of efficient distributed RAM
• Buried configuration interface
• Embedded processing and code shadowing
• Multi-voltage, multi-standard SelectIO interface pins
• Densities up to 25,344 logic cells
• 20 years Flash memory data retention
• Abundant, flexible logic resources
• Low-cost QFP and BGA Pb-free (RoHS) packaging options
• Full hot-swap compliance
configuration errors
• Unique Device DNA serial number in each device for
• Plentiful amounts of nonvolatile memory available to the user
• Configuration watchdog timer automatically recovers from
• Improves ease-of-use
• Reduces support issues
• Scratchpad memory
• Security features provide bitstream anti-cloning protection
• LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL differential I/O
• 622+ Mb/s data transfer rate per I/O

Request XC3S1400AN-4FG676I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

Xilinx XC3S1400AN-4FG676I Overview

The XC3S1400AN-4FG676I combines the best attributes of a
leading edge, low cost FPGA with nonvolatile technology across a
broad range of densities. The family combines all the features of
the Spartan-3A FPGA family plus leading technology in-system
Flash memory for configuration and nonvolatile data storage.
The Spartan-3AN FPGAs are part of the Extended Spartan-3A
family, which also includes the Spartan-3A FPGAs and the higher
density Spartan-3A DSP FPGAs. The Spartan-3AN FPGA family
is excellent for space-constrained applications such as blade
servers, medical devices, automotive infotainment, telematics,
GPS, and other small consumer products. Combining FPGA and
Flash technology minimizes chip count, PCB traces and overall
size while increasing system reliability.
The XC3S1400AN-4FG676I internal configuration interface is
completely self-contained, increasing design security. The family
maintains full support for external configuration. The XC3S1400AN  is the world’s first nonvolatile FPGA with MultiBoot,
supporting two or more configuration files in one device, allowing
alternative configurations for field upgrades, test modes, or
multiple system configurations.
The Xilinx FPGAs series XC3S1400AN-4FG676I is Spartan-3AN Family 1.4M Gates 25344 Cells 667MHz 90nm Technology 1.2V , View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S1400AN-4FG676I Tags integrated circuit

1. XC3S1400AN development board
2. Xilinx XC3S1400AN
3. XC3S1400AN evaluation board
4. Spartan-3AN FPGA starter kit
5. Spartan-3AN FPGA XC3S1400AN
6. XC3S1400AN-4FG676I Datasheet PDF
7. Xilinx Spartan-3AN FPGA development board
8. Spartan-3AN FPGA evaluation kit
9. Spartan-3AN FPGA starter kit

Xilinx XC3S1400AN-4FG676I TechnicalAttributes

-Package / Case 676-BBGA, FCBGA
-Mounting Type Surface Mount
-Number of LABs/CLBs 2816
-Number of Logic Elements/Cells 25344
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Total RAM Bits 589824
-Number of I/O 502

-Number of Gates 1400000
-Supplier Device Package 676-FCBGA (27×27)

-Voltage – Supply 1.14V ~ 1.26V

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