XC3S1400AN-4FGG484I ApplicationField
-Medical Equipment
-Consumer Electronics
-Internet of Things
-Industrial Control
-Artificial Intelligence
-Cloud Computing
-5G Technology
-Wireless Technology
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XC3S1400AN-4FGG484I FAQ Chips
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs XC3S1400AN-4FGG484I Features
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
• Optional shift register or distributed RAM support
• Up to eight Digital Clock Managers (DCMs)
• Suspend mode reduces system power consumption
• Improves ease-of-use
• Up to 24 mA output drive
• Up to 502 I/O pins or 227 differential signal pairs
• The new standard for low cost nonvolatile FPGA solutions
• DDR/DDR2 SDRAM support up to 400 Mb/s
• Plentiful amounts of nonvolatile memory available to the user
• Densities up to 25,344 logic cells
• Full hot-swap compliance
• Integrated robust configuration memory
• MicroBlaze and PicoBlaze embedded processor cores
• Unique Device DNA serial number in each device for
• Abundant, flexible logic resources
• Saves board space
• Fully compliant 32-/64-bit 33 MHz PCI technology support
configuration errors
• Flash memory sector protection and lockdown
• Configuration watchdog timer automatically recovers from
• 622+ Mb/s data transfer rate per I/O
• Complete Xilinx ISE and WebPACK software development system support
• 20 years Flash memory data retention
• Security features provide bitstream anti-cloning protection
• Buried configuration interface
• LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL differential I/O
• Robust 100K Flash memory program/erase cycles
• Enhanced 18 x 18 multipliers with optional pipeline
• Low-cost QFP and BGA Pb-free (RoHS) packaging options
• Multi-voltage, multi-standard SelectIO interface pins
• Embedded processing and code shadowing
• Up to 11+ Mb available
• Simplifies design
design Authentication to prevent unauthorized copying
• Eight global clocks and eight additional clocks per each half of device, plus abundant low-skew routing
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Up to 176 Kbits of efficient distributed RAM
• Pin-compatible with the same packages in the Spartan-3A FPGA family
• Fast response time, typically less than 100 μs
• Retains all design state and FPGA configuration data
• 3.3V ±10% compatibility and hot swap compliance
• Scratchpad memory
• Hierarchical SelectRAM memory architecture
• Up to 576 Kbits of dedicated block RAM
• Memory, multipliers, DCMs, SelectIO, hot swap, power management, etc.
• Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set
• Reduces support issues
• MultiBoot support
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Xilinx XC3S1400AN-4FGG484I Overview
The XC3S1400AN-4FGG484I combines the best attributes of a
leading edge, low cost FPGA with nonvolatile technology across a
broad range of densities. The family combines all the features of
the Spartan-3A FPGA family plus leading technology in-system
Flash memory for configuration and nonvolatile data storage.
The Spartan-3AN FPGAs are part of the Extended Spartan-3A
family, which also includes the Spartan-3A FPGAs and the higher
density Spartan-3A DSP FPGAs. The Spartan-3AN FPGA family
is excellent for space-constrained applications such as blade
servers, medical devices, automotive infotainment, telematics,
GPS, and other small consumer products. Combining FPGA and
Flash technology minimizes chip count, PCB traces and overall
size while increasing system reliability.
The XC3S1400AN-4FGG484I internal configuration interface is
completely self-contained, increasing design security. The family
maintains full support for external configuration. The XC3S1400AN is the world’s first nonvolatile FPGA with MultiBoot,
supporting two or more configuration files in one device, allowing
alternative configurations for field upgrades, test modes, or
multiple system configurations.
XC3S1400AN-4FGG484I Tags integrated circuit
1. XC3S1400AN evaluation board
2. Xilinx XC3S1400AN
3. Spartan-3AN FPGA evaluation kit
4. XC3S1400AN-4FGG484I Datasheet PDF
5. Xilinx Spartan-3AN FPGA development board
6. XC3S1400AN development board
7. XC3S1400AN reference design
8. Spartan-3AN FPGA starter kit
9. XC3S1400AN-4FGG484I Datasheet PDF
Xilinx XC3S1400AN-4FGG484I TechnicalAttributes
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 372
-Mounting Type Surface Mount
-Package / Case 484-BBGA
-Number of Gates 1400000
-Number of Logic Elements/Cells 25344
-Total RAM Bits 589824
-Supplier Device Package 484-FBGA (23×23)
-Voltage – Supply 1.14V ~ 1.26V
-Number of LABs/CLBs 2816
