XC3S1500L-4FGG320C -Industrial Control -Cloud Computing

XC3S1500L-4FGG320C ApplicationField

-Consumer Electronics
-5G Technology
-Artificial Intelligence
-Wireless Technology
-Medical Equipment
-Cloud Computing
-Internet of Things
-Industrial Control

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ICs XC3S1500L-4FGG320C Features

Wide multiplexers
Fully supported by Xilinx ISE® development systemSynthesis, mapping, placement, and routing
Power estimation using XPower tools
Pin-compatible with Spartan-3 FPGAs
Densities as high as 62,000 logic cells
Clock skew elimination
Low cost, low power logic solution for high-volume, consumer-oriented applicationsDensities as high as 62,000 logic cells
Dedicated 18 x 18 multipliers
Abundant logic cells with shift register capability
Eight global clock lines and abundant routing
Power current reduction compared to Spartan-3 family:Up to 60% less quiescent currentUp to 99% less quiescent current in Hibernate mode
Logic resourcesAbundant logic cells with shift register capabilityWide multiplexersFast look-ahead carry logicDedicated 18 x 18 multipliersJTAG logic compatible with IEEE 1149.1/1532
SelectRAM™ hierarchical memoryUp to 1,728 Kbits of total block RAMUp to 432 Kbits of total distributed RAM
Eight differential signal standards including LVDS and RSDS
Frequency synthesis
Pb-free packaging options
Up to 633 I/O pins
Up to 99% less quiescent current in Hibernate mode
SelectIO™ signalingUp to 633 I/O pinsEighteen single-ended signal standardsEight differential signal standards including LVDS and RSDSDouble Data Rate (DDR) support
Digital Clock Manager (four DCMs)Clock skew eliminationFrequency synthesisHigh-resolution phase shifting
Up to 1,728 Kbits of total block RAM
JTAG logic compatible with IEEE 1149.1/1532
Synthesis, mapping, placement, and routing
High-resolution phase shifting
Up to 432 Kbits of total distributed RAM
MicroBlaze™ processor and other cores
Up to 60% less quiescent current
Eighteen single-ended signal standards
Fast look-ahead carry logic
Double Data Rate (DDR) support

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Xilinx XC3S1500L-4FGG320C Overview

Spartan®-3L Field-Programmable Gate Arrays (FPGAs) consume less static current than corresponding members of the standard Spartan-3 family. Spartan-3L devices provide the identical function, features, timing, and pinout of the original Spartan-3 family. Features include programmable I/Os, Configurable Logic Blocks (CLBs), RAM blocks, Digital Clock Managers (DCMs), and Multiplier blocks.Another power-saving benefit of the Spartan-3L family beyond static current reduction is the Hibernate mode, which lowers device power consumption to the lowest possible levels. For new designs, consider the Spartan-3A family, which offers both Hibernate and Suspend power-saving modes.The three-member Spartan-3L family ranges in density from one to four million system gates and offers as many as 633 I/Os. All devices are specified to meet the –4 speed grade over the commercial temperature range.This data sheet explains how the Spartan-3L family is different from the Spartan-3 family. For specifications and other technical information not contained in this document, refer to the Spartan-3 data sheet (DS099).
The Xilinx FPGAs (Field Programmable Gate Array) series XC3S1500L-4FGG320C is Spartan-3 FPGA 221 I/O 320 FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S1500L-4FGG320C Tags integrated circuit

1. XC3S1500L-4FGG320C Datasheet PDF
2. XC3S1500L evaluation board
3. Spartan-3L Low Power FPGA starter kit
4. XC3S1500L development board
5. XC3S1500L reference design
6. Spartan-3L Low Power FPGA evaluation kit
7. Xilinx XC3S1500L
8. Spartan-3L Low Power FPGA XC3S1500L
9. XC3S1500L development board

Xilinx XC3S1500L-4FGG320C TechnicalAttributes

-Package / Case 320-BGA
-Number of Gates 1500000
-Mounting Type Surface Mount
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of Logic Elements/Cells 29952
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 589824

-Number of LABs/CLBs 2816
-Number of I/O 221

-Supplier Device Package 320-FBGA (19×19)

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