XC3S1500L-4FGG456C ApplicationField
-Industrial Control
-Artificial Intelligence
-Consumer Electronics
-Medical Equipment
-5G Technology
-Internet of Things
-Wireless Technology
-Cloud Computing
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XC3S1500L-4FGG456C FAQ Chips
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ICs XC3S1500L-4FGG456C Features
SelectIO™ signalingUp to 633 I/O pinsEighteen single-ended signal standardsEight differential signal standards including LVDS and RSDSDouble Data Rate (DDR) support
Eighteen single-ended signal standards
High-resolution phase shifting
Eight global clock lines and abundant routing
MicroBlaze™ processor and other cores
Fast look-ahead carry logic
Up to 99% less quiescent current in Hibernate mode
Eight differential signal standards including LVDS and RSDS
Up to 432 Kbits of total distributed RAM
Logic resourcesAbundant logic cells with shift register capabilityWide multiplexersFast look-ahead carry logicDedicated 18 x 18 multipliersJTAG logic compatible with IEEE 1149.1/1532
Fully supported by Xilinx ISE® development systemSynthesis, mapping, placement, and routing
Densities as high as 62,000 logic cells
Digital Clock Manager (four DCMs)Clock skew eliminationFrequency synthesisHigh-resolution phase shifting
Low cost, low power logic solution for high-volume, consumer-oriented applicationsDensities as high as 62,000 logic cells
Clock skew elimination
Up to 60% less quiescent current
Dedicated 18 x 18 multipliers
Pb-free packaging options
Frequency synthesis
JTAG logic compatible with IEEE 1149.1/1532
Power estimation using XPower tools
Up to 633 I/O pins
Up to 1,728 Kbits of total block RAM
Double Data Rate (DDR) support
Abundant logic cells with shift register capability
Wide multiplexers
Power current reduction compared to Spartan-3 family:Up to 60% less quiescent currentUp to 99% less quiescent current in Hibernate mode
SelectRAM™ hierarchical memoryUp to 1,728 Kbits of total block RAMUp to 432 Kbits of total distributed RAM
Pin-compatible with Spartan-3 FPGAs
Synthesis, mapping, placement, and routing
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Xilinx XC3S1500L-4FGG456C Overview
Spartan®-3L Field-Programmable Gate Arrays (FPGAs) consume less static current than corresponding members of the standard Spartan-3 family. Spartan-3L devices provide the identical function, features, timing, and pinout of the original Spartan-3 family. Features include programmable I/Os, Configurable Logic Blocks (CLBs), RAM blocks, Digital Clock Managers (DCMs), and Multiplier blocks.Another power-saving benefit of the Spartan-3L family beyond static current reduction is the Hibernate mode, which lowers device power consumption to the lowest possible levels. For new designs, consider the Spartan-3A family, which offers both Hibernate and Suspend power-saving modes.The three-member Spartan-3L family ranges in density from one to four million system gates and offers as many as 633 I/Os. All devices are specified to meet the –4 speed grade over the commercial temperature range.This data sheet explains how the Spartan-3L family is different from the Spartan-3 family. For specifications and other technical information not contained in this document, refer to the Spartan-3 data sheet (DS099).
The Xilinx Special equipment devices and IC series XC3S1500L-4FGG456C is Spartan-3 FPGA 333 I/O 456FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XC3S1500L-4FGG456C Tags integrated circuit
1. Spartan-3L Low Power FPGA evaluation kit
2. XC3S1500L reference design
3. XC3S1500L-4FGG456C Datasheet PDF
4. Xilinx Spartan-3L Low Power FPGA development board
5. Xilinx XC3S1500L
6. XC3S1500L development board
7. Spartan-3L Low Power FPGA XC3S1500L
8. XC3S1500L evaluation board
9. Xilinx Spartan-3L Low Power FPGA development board
Xilinx XC3S1500L-4FGG456C TechnicalAttributes
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Supplier Device Package 456-FBGA (23×23)
-Voltage – Supply 1.14V ~ 1.26V
-Number of LABs/CLBs 2816
-Number of Gates 1500000
-Number of Logic Elements/Cells 29952
-Mounting Type Surface Mount
-Total RAM Bits 589824
-Number of I/O 333
-Package / Case 456-BBGA