XC3S1500L-4FGG676C ApplicationField
-Cloud Computing
-5G Technology
-Consumer Electronics
-Medical Equipment
-Artificial Intelligence
-Wireless Technology
-Industrial Control
-Internet of Things
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ICs XC3S1500L-4FGG676C Features
SelectRAM™ hierarchical memoryUp to 1,728 Kbits of total block RAMUp to 432 Kbits of total distributed RAM
Pb-free packaging options
Synthesis, mapping, placement, and routing
Densities as high as 62,000 logic cells
High-resolution phase shifting
Eighteen single-ended signal standards
Digital Clock Manager (four DCMs)Clock skew eliminationFrequency synthesisHigh-resolution phase shifting
Up to 432 Kbits of total distributed RAM
Wide multiplexers
Up to 1,728 Kbits of total block RAM
SelectIO™ signalingUp to 633 I/O pinsEighteen single-ended signal standardsEight differential signal standards including LVDS and RSDSDouble Data Rate (DDR) support
Frequency synthesis
Pin-compatible with Spartan-3 FPGAs
Fully supported by Xilinx ISE® development systemSynthesis, mapping, placement, and routing
Up to 60% less quiescent current
MicroBlaze™ processor and other cores
Eight differential signal standards including LVDS and RSDS
Up to 633 I/O pins
Up to 99% less quiescent current in Hibernate mode
JTAG logic compatible with IEEE 1149.1/1532
Dedicated 18 x 18 multipliers
Logic resourcesAbundant logic cells with shift register capabilityWide multiplexersFast look-ahead carry logicDedicated 18 x 18 multipliersJTAG logic compatible with IEEE 1149.1/1532
Low cost, low power logic solution for high-volume, consumer-oriented applicationsDensities as high as 62,000 logic cells
Power current reduction compared to Spartan-3 family:Up to 60% less quiescent currentUp to 99% less quiescent current in Hibernate mode
Fast look-ahead carry logic
Eight global clock lines and abundant routing
Power estimation using XPower tools
Double Data Rate (DDR) support
Abundant logic cells with shift register capability
Clock skew elimination
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Xilinx XC3S1500L-4FGG676C Overview
Spartan®-3L Field-Programmable Gate Arrays (FPGAs) consume less static current than corresponding members of the standard Spartan-3 family. Spartan-3L devices provide the identical function, features, timing, and pinout of the original Spartan-3 family. Features include programmable I/Os, Configurable Logic Blocks (CLBs), RAM blocks, Digital Clock Managers (DCMs), and Multiplier blocks.Another power-saving benefit of the Spartan-3L family beyond static current reduction is the Hibernate mode, which lowers device power consumption to the lowest possible levels. For new designs, consider the Spartan-3A family, which offers both Hibernate and Suspend power-saving modes.The three-member Spartan-3L family ranges in density from one to four million system gates and offers as many as 633 I/Os. All devices are specified to meet the –4 speed grade over the commercial temperature range.This data sheet explains how the Spartan-3L family is different from the Spartan-3 family. For specifications and other technical information not contained in this document, refer to the Spartan-3 data sheet (DS099).
The Xilinx Special equipment devices and IC series XC3S1500L-4FGG676C is Conn H4 Female 8mm², View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XC3S1500L-4FGG676C Tags integrated circuit
1. Xilinx Spartan-3L Low Power FPGA development board
2. XC3S1500L evaluation board
3. Spartan-3L Low Power FPGA starter kit
4. XC3S1500L development board
5. Xilinx XC3S1500L
6. XC3S1500L reference design
7. Spartan-3L Low Power FPGA evaluation kit
8. XC3S1500L-4FGG676C Datasheet PDF
9. XC3S1500L development board
Xilinx XC3S1500L-4FGG676C TechnicalAttributes
-Number of Logic Elements/Cells 29952
-Supplier Device Package 676-FBGA (27×27)
-Number of I/O 487
-Package / Case 676-BGA
-Number of Gates 1500000
-Voltage – Supply 1.14V ~ 1.26V
-Number of LABs/CLBs 2816
-Total RAM Bits 589824
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Mounting Type Surface Mount
