XC3S1600E-4FGG320I ApplicationField
-Cloud Computing
-Artificial Intelligence
-Wireless Technology
-5G Technology
-Medical Equipment
-Industrial Control
-Consumer Electronics
-Internet of Things
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XC3S1600E-4FGG320I FAQ Chips
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ICs XC3S1600E-4FGG320I Features
– Wide multiplexers
– Clock skew elimination
– JTAG logic compatible with IEEE 1149.1/1532
• Logic resources
– Double Data Rate (DDR) support
and RSDS
• Digital Clock Manager (four DCMs)
– Fast look-ahead carry logic
– Eight differential signal standards including LVDS
• SelectRAM hierarchical memory
– Up to 432 Kbits of total distributed RAM
– High-resolution phase shifting
– Abundant logic cells with shift register capability
– Up to 1,728 Kbits of total block RAM
– Dedicated 18 x 18 multipliers
– Frequency synthesis
– Eighteen single-ended signal standards
– Up to 633 I/O pins
• SelectIO signaling
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Xilinx XC3S1600E-4FGG320I Overview
Introduction
The Spartan®-3E family of Field-Programmable Gate
Arrays (FPGAs) is specifically designed to meet the needs
of high volume, cost-sensitive consumer electronic
applications. The five-member family offers densities
ranging from 100,000 to 1.6 million system gates, as shown
in Table 1.
The Spartan-3E family builds on the success of the earlier
Spartan-3 family by increasing the amount of logic per I/O,
significantly reducing the cost per logic cell. New features
improve system performance and reduce the cost of
configuration. These Spartan-3E FPGA enhancements,
combined with advanced 90 nm process technology, deliver
more functionality and bandwidth per dollar than was
previously possible, setting new standards in the
programmable logic industry.
Because of their exceptionally low cost, Spartan-3E FPGAs
are ideally suited to a wide range of consumer electronics
applications, including broadband access, home
networking, display/projection, and digital television
equipment.
The Spartan-3E family is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost, the
lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits
design upgrades in the field with no hardware replacement
necessary, an impossibility with ASICs.
Features
• Very low cost, high-performance logic solution for high-volume, consumer-oriented applications
• Proven advanced 90-nanometer process technology
• Multi-voltage, multi-standard SelectIO™ interface pins
• Up to 376 I/O pins or 156 differential signal pairs
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• 622+ Mb/s data transfer rate per I/O
• True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O
• Enhanced Double Data Rate (DDR) support
• DDR SDRAM support up to 333 Mb/s
• Abundant, flexible logic resources
• Densities up to 33,192 logic cells, including optional shift register or distributed RAM support
• Efficient wide multiplexers, wide logic
• Fast look-ahead carry logic
• Enhanced 18 x 18 multipliers with optional pipeline
• IEEE 1149.1/1532 JTAG programming/debug port
• Hierarchical SelectRAM™ memory architecture
• Up to 648 Kbits of fast block RAM
• Up to 231 Kbits of efficient distributed RAM
• Up to eight Digital Clock Managers (DCMs)
• Clock skew elimination (delay locked loop)
• Frequency synthesis, multiplication, division
• High-resolution phase shifting
• Wide frequency range (5 MHz to over 300 MHz)
• Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing
• Configuration interface to industry-standard PROMs
• Low-cost, space-saving SPI serial Flash PROM
• x8 or x8/x16 parallel NOR Flash PROM
• Low-cost Xilinx® Platform Flash with JTAG
• Complete Xilinx ISE® and WebPACK™ software
• MicroBlaze™ and PicoBlaze embedded processor cores
• Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices)
• Low-cost QFP and BGA packaging options
• Common footprints support easy density migration
• Pb-free packaging options
• XA Automotive version available
The Xilinx Industrial components series XC3S1600E-4FGG320I is FPGA Spartan-3E Family 1.6M Gates 33192 Cells 572MHz 90nm (CMOS) Technology 1.2V , View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC3S1600E-4FGG320I Tags integrated circuit
1. Xilinx Spartan-3E FPGA development board
2. Spartan-3E FPGA evaluation kit
3. XC3S1600E evaluation board
4. XC3S1600E-4FGG320I Datasheet PDF
5. XC3S1600E reference design
6. XC3S1600E development board
7. Spartan-3E FPGA starter kit
8. Xilinx XC3S1600E
9. XC3S1600E-4FGG320I Datasheet PDF
Xilinx XC3S1600E-4FGG320I TechnicalAttributes
-Supplier Device Package 320-FBGA (19×19)
-Number of LABs/CLBs 3688
-Number of Logic Elements/Cells 33192
-Total RAM Bits 663552
-Package / Case 320-BGA
-Voltage – Supply 1.14V ~ 1.26V
-Number of Gates 1600000
-Mounting Type Surface Mount
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 250
