XC3S200-4FTG256C ApplicationField
-Consumer Electronics
-Cloud Computing
-5G Technology
-Industrial Control
-Medical Equipment
-Wireless Technology
-Artificial Intelligence
-Internet of Things
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XC3S200-4FTG256C FAQ Chips
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ICs XC3S200-4FTG256C Features
• JTAG logic compatible with IEEE 1149.1/1532
consumer-oriented applications
• SelectRAM hierarchical memory
• Wide, fast multiplexers
• Up to 520 Kbits of total distributed RAM
• Termination by Digitally Controlled Impedance
• Up to 633 I/O pins
• Dedicated 18 x 18 multipliers
• Up to 1,872 Kbits of total block RAM
• Clock skew elimination
• Signal swing ranging from 1.14V to 3.465V
• Abundant logic cells with shift register capability
• Fast look-ahead carry logic
• Frequency synthesis
• Digital Clock Manager (up to four DCMs)
• Double Data Rate (DDR) support
• 18 single-ended signal standards
• 622+ Mb/s data transfer rate per I/O
• 8 differential I/O standards including LVDS, RSDS
• Low-cost, high-performance logic solution for high-volume,
• Logic resources
• High resolution phase shifting
• DDR, DDR2 SDRAM support up to 333 Mb/s
• SelectIO interface signaling
• Densities up to 74,880 logic cells
Request XC3S200-4FTG256C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XC3S200-4FTG256C Overview
The XC3S200-4FTG256C of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.The XC3S200-4FTG256C builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex-II platform technology. These XC3S200-4FTG256C FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S200-4FTG256C are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The Spartan XC3S200-4FTG256C is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S200-4FTG256C FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx FPGAs series XC3S200-4FTG256C is Spartan-3 Family 200K Gates 4320 Cells 630MHz 90nm Technology 1.2V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC3S200-4FTG256C Tags integrated circuit
1. Spartan-3 FPGA evaluation kit
2. Spartan-3 FPGA XC3S200
3. Spartan-3 FPGA starter kit
4. Xilinx Spartan-3 FPGA development board
5. Xilinx XC3S200
6. XC3S200-4FTG256C Datasheet PDF
7. XC3S200 development board
8. XC3S200 evaluation board
9. Xilinx Spartan-3 FPGA development board
Xilinx XC3S200-4FTG256C TechnicalAttributes
-Supplier Device Package 256-FTBGA (17×17)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Package / Case 256-LBGA
-Number of LABs/CLBs 480
-Number of Logic Elements/Cells 4320
-Total RAM Bits 221184
-Number of Gates 200000
-Voltage – Supply 1.14V ~ 1.26V
-Number of I/O 173
-Mounting Type Surface Mount
