XC3S2000-4FG676C -Artificial Intelligence -5G Technology

XC3S2000-4FG676C ApplicationField

-Wireless Technology
-Internet of Things
-Cloud Computing
-Consumer Electronics
-Medical Equipment
-5G Technology
-Industrial Control
-Artificial Intelligence

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XC3S2000-4FG676C FAQ Chips 

Q: How to obtain XC3S2000-4FG676C technical support documents?
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Q: Where can I purchase Xilinx XC3S2000 Development Boards, Evaluation Boards, or Spartan-3 FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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ICs XC3S2000-4FG676C Features

• Dedicated 18 x 18 multipliers
• Signal swing ranging from 1.14V to 3.465V
• Up to 1,872 Kbits of total block RAM
• Low-cost, high-performance logic solution for high-volume,
• Logic resources
• Frequency synthesis
• 18 single-ended signal standards
consumer-oriented applications
• 8 differential I/O standards including LVDS, RSDS
• SelectIO interface signaling
• JTAG logic compatible with IEEE 1149.1/1532
• Up to 633 I/O pins
• Up to 520 Kbits of total distributed RAM
• Fast look-ahead carry logic
• Wide, fast multiplexers
• High resolution phase shifting
                                               
• Double Data Rate (DDR) support
• DDR, DDR2 SDRAM support up to 333 Mb/s
• Clock skew elimination
• SelectRAM hierarchical memory
• Densities up to 74,880 logic cells
• 622+ Mb/s data transfer rate per I/O
• Abundant logic cells with shift register capability
• Termination by Digitally Controlled Impedance
• Digital Clock Manager (up to four DCMs)

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Xilinx XC3S2000-4FG676C Overview

The XC3S2000-4FG676C of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.The XC3S2000-4FG676C builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex-II platform technology. These XC3S2000-4FG676C FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S2000-4FG676C are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The Spartan XC3S2000-4FG676C is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S2000-4FG676C FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx FPGAs series XC3S2000-4FG676C is 2000000 SYSTEM GATE 1.2 VOLT FPGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S2000-4FG676C Tags integrated circuit

1. Spartan-3 FPGA starter kit
2. Spartan-3 FPGA XC3S2000
3. XC3S2000 development board
4. XC3S2000 reference design
5. XC3S2000 evaluation board
6. Xilinx Spartan-3 FPGA development board
7. XC3S2000-4FG676C Datasheet PDF
8. Xilinx XC3S2000
9. XC3S2000 reference design

Xilinx XC3S2000-4FG676C TechnicalAttributes

-Total RAM Bits 737280
-Number of Gates 2000000
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Supplier Device Package 676-FCBGA (27×27)
-Number of LABs/CLBs 5120
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 46080

-Number of I/O 489
-Package / Case 676-BBGA, FCBGA

-Voltage – Supply 1.14V ~ 1.26V

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