XC3S250E-5FTG256C -Internet of Things -5G Technology

XC3S250E-5FTG256C ApplicationField

-Artificial Intelligence
-Consumer Electronics
-Cloud Computing
-Medical Equipment
-Wireless Technology
-5G Technology
-Industrial Control
-Internet of Things

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XC3S250E-5FTG256C FAQ Chips 

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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A: Enter the “XC3S250E-5FTG256C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Where can I purchase Xilinx XC3S250E Development Boards, Evaluation Boards, or Spartan-3E FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: Does the price of XC3S250E-5FTG256C devices fluctuate frequently?
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ICs XC3S250E-5FTG256C Features

– Double Data Rate (DDR) support
– Wide multiplexers
• Digital Clock Manager (four DCMs)
and RSDS
– Dedicated 18 x 18 multipliers
– Up to 633 I/O pins
– Up to 1,728 Kbits of total block RAM
– Fast look-ahead carry logic
– JTAG logic compatible with IEEE 1149.1/1532
• SelectIO signaling
• SelectRAM hierarchical memory
– Abundant logic cells with shift register capability
– High-resolution phase shifting
                                               
– Eight differential signal standards including LVDS
– Eighteen single-ended signal standards

– Clock skew elimination
– Up to 432 Kbits of total distributed RAM
– Frequency synthesis

• Logic resources

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Xilinx XC3S250E-5FTG256C Overview

The XC3S250E-5FTG256C of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.The XC3S250E-5FTG256C builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex-II platform technology. These XC3S250E-5FTG256C FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S250E-5FTG256C are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The Spartan XC3S250E-5FTG256C is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S250E-5FTG256C FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC3S250E-5FTG256C is Spartan-3E FPGA 172 I/O 256FTBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S250E-5FTG256C Tags integrated circuit

1. Spartan-3E FPGA XC3S250E
2. XC3S250E development board
3. Spartan-3E FPGA starter kit
4. Xilinx XC3S250E
5. XC3S250E reference design
6. Spartan-3E FPGA evaluation kit
7. XC3S250E evaluation board
8. Xilinx Spartan-3E FPGA development board
9. Xilinx XC3S250E

Xilinx XC3S250E-5FTG256C TechnicalAttributes

-Package / Case 256-LBGA
-Supplier Device Package 256-FTBGA (17×17)
-Total RAM Bits 221184
-Number of LABs/CLBs 612
-Mounting Type Surface Mount
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of I/O 172

-Number of Gates 250000
-Number of Logic Elements/Cells 5508

-Voltage – Supply 1.14V ~ 1.26V