XC3S400-4FGG456C -Internet of Things -Artificial Intelligence

XC3S400-4FGG456C ApplicationField

-Cloud Computing
-Industrial Control
-Wireless Technology
-5G Technology
-Consumer Electronics
-Artificial Intelligence
-Medical Equipment
-Internet of Things

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XC3S400-4FGG456C FAQ Chips 

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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ICs XC3S400-4FGG456C Features

• Clock skew elimination
• High resolution phase shifting
                                               
• Digital Clock Manager (up to four DCMs)
• Densities up to 74,880 logic cells
• Wide, fast multiplexers
• Low-cost, high-performance logic solution for high-volume,
• Frequency synthesis
• Abundant logic cells with shift register capability
consumer-oriented applications
• 8 differential I/O standards including LVDS, RSDS
• Signal swing ranging from 1.14V to 3.465V
• Double Data Rate (DDR) support
• Up to 633 I/O pins
• Fast look-ahead carry logic
• Dedicated 18 x 18 multipliers
• SelectRAM hierarchical memory
• Termination by Digitally Controlled Impedance
• 622+ Mb/s data transfer rate per I/O
• SelectIO interface signaling
• JTAG logic compatible with IEEE 1149.1/1532
• Up to 520 Kbits of total distributed RAM
• DDR, DDR2 SDRAM support up to 333 Mb/s
• Up to 1,872 Kbits of total block RAM
• Logic resources
• 18 single-ended signal standards

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Xilinx XC3S400-4FGG456C Overview

The XC3S400-4FGG456C of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications.The XC3S400-4FGG456C builds on the success of the earlier Spartan-IIE family by increasing the amount of logic resources, the capacity of internal RAM, the total number of I/Os, and the overall level of performance as well as by improving clock management functions. Numerous enhancements derive from the Virtex-II platform technology. These XC3S400-4FGG456C FPGA enhancements, combined with advanced process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry.Because of their exceptionally low cost, XC3S400-4FGG456C are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection and digital television equipment.The Spartan XC3S400-4FGG456C is a superior alternative to mask programmed ASICs. avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, XC3S400-4FGG456C FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs.
The Xilinx FPGAs series XC3S400-4FGG456C is 400000 SYSTEM GATE 1.2 VOLT FPGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3S400-4FGG456C Tags integrated circuit

1. XC3S400 development board
2. Xilinx Spartan-3 FPGA development board
3. XC3S400 reference design
4. Spartan-3 FPGA XC3S400
5. XC3S400 evaluation board
6. XC3S400-4FGG456C Datasheet PDF
7. Xilinx XC3S400
8. Spartan-3 FPGA starter kit
9. Spartan-3 FPGA XC3S400

Xilinx XC3S400-4FGG456C TechnicalAttributes

-Voltage – Supply 1.14V ~ 1.26V
-Mounting Type Surface Mount
-Package / Case 456-BBGA
-Supplier Device Package 456-FBGA (23×23)
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of I/O 264
-Number of Gates 400000

-Number of Logic Elements/Cells 8064
-Number of LABs/CLBs 896

-Total RAM Bits 294912

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