XC3S500E-4FGG320I ApplicationField
-Internet of Things
-5G Technology
-Industrial Control
-Cloud Computing
-Artificial Intelligence
-Consumer Electronics
-Medical Equipment
-Wireless Technology
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XC3S500E-4FGG320I FAQ Chips
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Where can I purchase Xilinx XC3S500E Development Boards, Evaluation Boards, or Spartan-3E FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: Does the price of XC3S500E-4FGG320I devices fluctuate frequently?
A: The RAYPCB search engine monitors the XC3S500E-4FGG320I inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
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ICs XC3S500E-4FGG320I Features
– Frequency synthesis
– Fast look-ahead carry logic
– Up to 432 Kbits of total distributed RAM
– Eighteen single-ended signal standards
– High-resolution phase shifting
– Double Data Rate (DDR) support
– Eight differential signal standards including LVDS
– Dedicated 18 x 18 multipliers
– Abundant logic cells with shift register capability
• SelectRAM hierarchical memory
– Up to 1,728 Kbits of total block RAM
– Up to 633 I/O pins
– Clock skew elimination
• Logic resources
– JTAG logic compatible with IEEE 1149.1/1532
and RSDS
• Digital Clock Manager (four DCMs)
– Wide multiplexers
• SelectIO signaling
Request XC3S500E-4FGG320I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XC3S500E-4FGG320I Overview
Introduction
The Spartan®-3E family of Field-Programmable Gate
Arrays (FPGAs) is specifically designed to meet the needs
of high volume, cost-sensitive consumer electronic
applications. The five-member family offers densities
ranging from 100,000 to 1.6 million system gates, as shown
in Table 1.
The Spartan-3E family builds on the success of the earlier
Spartan-3 family by increasing the amount of logic per I/O,
significantly reducing the cost per logic cell. New features
improve system performance and reduce the cost of
configuration. These Spartan-3E FPGA enhancements,
combined with advanced 90 nm process technology, deliver
more functionality and bandwidth per dollar than was
previously possible, setting new standards in the
programmable logic industry.
Because of their exceptionally low cost, Spartan-3E FPGAs
are ideally suited to a wide range of consumer electronics
applications, including broadband access, home
networking, display/projection, and digital television
equipment.
The Spartan-3E family is a superior alternative to mask
programmed ASICs. FPGAs avoid the high initial cost, the
lengthy development cycles, and the inherent inflexibility of
conventional ASICs. Also, FPGA programmability permits
design upgrades in the field with no hardware replacement
necessary, an impossibility with ASICs.
Features
• Very low cost, high-performance logic solution for
high-volume, consumer-oriented applications
• Proven advanced 90-nanometer process technology
• Multi-voltage, multi-standard SelectIO™ interface pins
• Up to 376 I/O pins or 156 differential signal pairs
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal
standards
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• 622+ Mb/s data transfer rate per I/O
• True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL
differential I/O
• Enhanced Double Data Rate (DDR) support
• DDR SDRAM support up to 333 Mb/s
• Abundant, flexible logic resources
• Densities up to 33,192 logic cells, including optional shift
register or distributed RAM support
• Efficient wide multiplexers, wide logic
• Fast look-ahead carry logic
• Enhanced 18 x 18 multipliers with optional pipeline
• IEEE 1149.1/1532 JTAG programming/debug port
• Hierarchical SelectRAM™ memory architecture
• Up to 648 Kbits of fast block RAM
• Up to 231 Kbits of efficient distributed RAM
• Up to eight Digital Clock Managers (DCMs)
• Clock skew elimination (delay locked loop)
• Frequency synthesis, multiplication, division
• High-resolution phase shifting
• Wide frequency range (5 MHz to over 300 MHz)
• Eight global clocks plus eight additional clocks per each half
of device, plus abundant low-skew routing
• Configuration interface to industry-standard PROMs
• Low-cost, space-saving SPI serial Flash PROM
• x8 or x8/x16 parallel NOR Flash PROM
• Low-cost Xilinx® Platform Flash with JTAG
• Complete Xilinx ISE® and WebPACK™ software
• MicroBlaze™ and PicoBlaze embedded processor cores
• Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in
some devices)
• Low-cost QFP and BGA packaging options
• Common footprints support easy density migration
• Pb-free packaging options
• XA Automotive version available
The Xilinx FPGAs (Field Programmable Gate Array) series XC3S500E-4FGG320I is Spartan-3E FPGA 232 I/O 320FBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC3S500E-4FGG320I Tags integrated circuit
1. Spartan-3E FPGA XC3S500E
2. XC3S500E development board
3. XC3S500E reference design
4. XC3S500E evaluation board
5. XC3S500E-4FGG320I Datasheet PDF
6. Xilinx XC3S500E
7. Xilinx Spartan-3E FPGA development board
8. Spartan-3E FPGA evaluation kit
9. XC3S500E evaluation board
Xilinx XC3S500E-4FGG320I TechnicalAttributes
-Number of Logic Elements/Cells 10476
-Mounting Type Surface Mount
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 368640
-Number of LABs/CLBs 1164
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 232
-Number of Gates 500000
-Supplier Device Package 320-FBGA (19×19)
-Package / Case 320-BGA
