XC3S700AN-4FGG484I ApplicationField
-Medical Equipment
-5G Technology
-Artificial Intelligence
-Industrial Control
-Cloud Computing
-Consumer Electronics
-Wireless Technology
-Internet of Things
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XC3S700AN-4FGG484I FAQ Chips
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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Q: Where can I purchase Xilinx XC3S700AN Development Boards, Evaluation Boards, or Spartan-3AN FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs XC3S700AN-4FGG484I Features
• Full hot-swap compliance
• The new standard for low cost nonvolatile FPGA solutions
• Pin-compatible with the same packages in the Spartan-3A FPGA family
• Embedded processing and code shadowing
• Up to 176 Kbits of efficient distributed RAM
• Low-cost QFP and BGA Pb-free (RoHS) packaging options
design Authentication to prevent unauthorized copying
• Flash memory sector protection and lockdown
• Reduces support issues
• Memory, multipliers, DCMs, SelectIO, hot swap, power management, etc.
• Complete Xilinx ISE and WebPACK software development system support
• Eliminates traditional nonvolatile FPGA limitations with the advanced 90 nm Spartan-3A device feature set
• Multi-voltage, multi-standard SelectIO interface pins
• Optional shift register or distributed RAM support
• LVDS, RSDS, mini-LVDS, PPDS, and HSTL/SSTL differential I/O
• Densities up to 25,344 logic cells
• Unique Device DNA serial number in each device for
• LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards
• Retains all design state and FPGA configuration data
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• 3.3V ±10% compatibility and hot swap compliance
• Fast response time, typically less than 100 μs
• 622+ Mb/s data transfer rate per I/O
configuration errors
• Up to 502 I/O pins or 227 differential signal pairs
• MicroBlaze and PicoBlaze embedded processor cores
• Robust 100K Flash memory program/erase cycles
• DDR/DDR2 SDRAM support up to 400 Mb/s
• Enhanced 18 x 18 multipliers with optional pipeline
• Security features provide bitstream anti-cloning protection
• Simplifies design
• 20 years Flash memory data retention
• Up to 24 mA output drive
• Saves board space
• Up to 576 Kbits of dedicated block RAM
• Buried configuration interface
• Hierarchical SelectRAM memory architecture
• Plentiful amounts of nonvolatile memory available to the user
• Up to eight Digital Clock Managers (DCMs)
• Abundant, flexible logic resources
• Fully compliant 32-/64-bit 33 MHz PCI technology support
• MultiBoot support
• Suspend mode reduces system power consumption
• Up to 11+ Mb available
• Improves ease-of-use
• Integrated robust configuration memory
• Eight global clocks and eight additional clocks per each half of device, plus abundant low-skew routing
• Scratchpad memory
• Configuration watchdog timer automatically recovers from
Request XC3S700AN-4FGG484I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XC3S700AN-4FGG484I Overview
The XC3S700AN devices combines the best attributes of a
leading edge, low cost FPGA with nonvolatile technology across a
broad range of densities. The family combines all the features of
the Spartan-3A FPGA family plus leading technology in-system
Flash memory for configuration and nonvolatile data storage.
The XC3S700AN is part of the Extended Spartan-3A
family, which also includes the Spartan-3A FPGAs and the higher
density Spartan-3A DSP FPGAs. The Spartan-3AN FPGA family
is excellent for space-constrained applications such as blade
servers, medical devices, automotive infotainment, telematics,
GPS, and other small consumer products. Combining FPGA and
Flash technology minimizes chip count, PCB traces and overall
size while increasing system reliability.
The XC3S700AN-4FGG484I internal configuration interface is
completely self-contained, increasing design security. The family
maintains full support for external configuration. The XC3S700AN-4FGG484I is the world’s first nonvolatile FPGA with MultiBoot,
supporting two or more configuration files in one device, allowing
alternative configurations for field upgrades, test modes, or
multiple system configurations.
The Xilinx FPGAs series XC3S700AN-4FGG484I is FPGA Spartan-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC3S700AN-4FGG484I Tags integrated circuit
1. XC3S700AN development board
2. Xilinx Spartan-3AN FPGA development board
3. XC3S700AN evaluation board
4. Spartan-3AN FPGA starter kit
5. XC3S700AN-4FGG484I Datasheet PDF
6. Spartan-3AN FPGA XC3S700AN
7. Spartan-3AN FPGA evaluation kit
8. XC3S700AN reference design
9. Spartan-3AN FPGA starter kit
Xilinx XC3S700AN-4FGG484I TechnicalAttributes
-Supplier Device Package 484-FBGA (23×23)
-Number of Logic Elements/Cells 13248
-Mounting Type Surface Mount
-Number of Gates 700000
-Number of I/O 372
-Total RAM Bits 368640
-Voltage – Supply 1.14V ~ 1.26V
-Number of LABs/CLBs 1472
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Package / Case 484-BBGA
