XC3SD3400A-4FGG676C ApplicationField
-Consumer Electronics
-Cloud Computing
-Artificial Intelligence
-Wireless Technology
-Industrial Control
-Internet of Things
-5G Technology
-Medical Equipment
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XC3SD3400A-4FGG676C FAQ Chips
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ICs XC3SD3400A-4FGG676C Features
• Hierarchical SelectRAM memory architecture
• Common footprints support easy density migration
• Densities up to 53712 logic cells, including optional shift register
• Load multiple bitstreams under FPGA control
• 250 MHz XtremeDSP DSP48A Slices
• Fully compliant 32-/64-bit, 33/66 MHz PCI support
• Enhanced Double Data Rate (DDR) support
• Clock skew elimination (delay locked loop)
• MicroBlaze and PicoBlaze embedded processor cores
• DDR/DDR2 SDRAM support up to 333 Mb/s
• Unique Device DNA identifier for design authentication
• Optional cascaded Multiply or MAC
• Low-power option reduces quiescent current
• Full 3.3V ± 10% compatibility and hot swap compliance
• Dedicated 18-bit by 18-bit multiplier
• Suspend, Hibernate modes reduce system power
• Configuration interface to industry-standard PROMs
• Very low cost, high-performance DSP solution for high-volume, cost-conscious applications
• x8 or x8/x16 BPI parallel NOR Flash PROM
• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing
• Wide frequency range (5 MHz to over 320 MHz)
• Eight Digital Clock Managers (DCMs)
• Efficient wide multiplexers, wide logic, fast carry logic
• BGA and CSP packaging with Pb-free options
• Frequency synthesis, multiplication, division
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Selectable output drive, up to 24 mA per pin
• LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
• IEEE 1149.1/1532 JTAG programming/debug port
• 622+ Mb/s data transfer rate per differential I/O
• Multi-voltage, multi-standard SelectIO interface pins
• Integrated 18-bit pre-adder
• Low-cost, space-saving SPI serial Flash PROM
• Up to 519 I/O pins or 227 differential signal pairs
• High-resolution phase shifting
• Integrated adder for complex multiply or multiply-add operation
• Registered outputs on the block RAM with operation of at least 280 MHz in the standard -4 speed grade
• Up to 2268 Kbits of fast block RAM with byte write enables for processor applications
• QUIETIO standard reduces I/O switching noise
• XA Automotive version available
• Available pipeline stages for enhanced performance of at least 250 MHz in the standard -4 speed grade
• Dual-range VCCAUX supply simplifies 3.3V-only design
• Up to 373 Kbits of efficient distributed RAM
• Low-cost Xilinx Platform Flash with JTAG
• Abundant, flexible logic resources
• 48-bit accumulator for multiply-accumulate (MAC) operation
• Post-configuration CRC checking
• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors
Request XC3SD3400A-4FGG676C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XC3SD3400A-4FGG676C Overview
Features
• Very low cost, high-performance DSP solution for high-volume, cost-conscious applications
• 250 MHz XtremeDSP DSP48A Slices
• Dedicated 18-bit by 18-bit multiplier
• Available pipeline stages for enhanced performance of at least 250 MHz in the standard -4 speed grade
• 48-bit accumulator for multiply-accumulate (MAC) operation
• Integrated adder for complex multiply or multiply-add operation
• Integrated 18-bit pre-adder
• Optional cascaded Multiply or MAC
• Hierarchical SelectRAM™ memory architecture
• Up to 2268 Kbits of fast block RAM with byte write enables for processor applications
• Up to 373 Kbits of efficient distributed RAM
• Registered outputs on the block RAM with operation of at least 280 MHz in the standard -4 speed grade
• Dual-range VCCAUX supply simplifies 3.3V-only design
• Suspend, Hibernate modes reduce system power
• Low-power option reduces quiescent current
• Multi-voltage, multi-standard SelectIO™ interface pins
• Up to 519 I/O pins or 227 differential signal pairs
• LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Selectable output drive, up to 24 mA per pin
• QUIETIO standard reduces I/O switching noise
• Full 3.3V ± 10% compatibility and hot swap compliance
• 622+ Mb/s data transfer rate per differential I/O
• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors
• Enhanced Double Data Rate (DDR) support
• DDR/DDR2 SDRAM support up to 333 Mb/s
• Fully compliant 32-/64-bit, 33/66 MHz PCI support
• Abundant, flexible logic resources
• Densities up to 53712 logic cells, including optional shift register
• Efficient wide multiplexers, wide logic, fast carry logic
• IEEE 1149.1/1532 JTAG programming/debug port
• Eight Digital Clock Managers (DCMs)
• Clock skew elimination (delay locked loop)
• Frequency synthesis, multiplication, division
• High-resolution phase shifting
• Wide frequency range (5 MHz to over 320 MHz)
• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing
• Configuration interface to industry-standard PROMs
• Low-cost, space-saving SPI serial Flash PROM
• x8 or x8/x16 BPI parallel NOR Flash PROM
• Low-cost Xilinx® Platform Flash with JTAG
• Unique Device DNA identifier for design authentication
• Load multiple bitstreams under FPGA control
• Post-configuration CRC checking
• MicroBlaze™ and PicoBlaze™ embedded processor cores
• BGA and CSP packaging with Pb-free options
• Common footprints support easy density migration
• XA Automotive version available
The Xilinx FPGAs series XC3SD3400A-4FGG676C is FPGA Spartan-3A DSP Family 3.4M Gates 53712 Cells 667MHz 90nm Technology 1.2V , View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC3SD3400A-4FGG676C Tags integrated circuit
1. Spartan-3A DSP FPGA evaluation kit
2. Xilinx XC3SD3400A
3. XC3SD3400A-4FGG676C Datasheet PDF
4. XC3SD3400A development board
5. Spartan-3A DSP FPGA XC3SD3400A
6. Xilinx Spartan-3A DSP FPGA development board
7. Spartan-3A DSP FPGA starter kit
8. XC3SD3400A reference design
9. XC3SD3400A development board
Xilinx XC3SD3400A-4FGG676C TechnicalAttributes
-Number of Gates 3400000
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 2322432
-Package / Case 676-BGA
-Number of Logic Elements/Cells 53712
-Number of I/O 469
-Supplier Device Package 676-FBGA (27×27)
-Number of LABs/CLBs 5968
-Mounting Type Surface Mount
