XC3SD3400A-4FGG676C -Medical Equipment -Internet of Things

XC3SD3400A-4FGG676C ApplicationField

-Consumer Electronics
-Cloud Computing
-Artificial Intelligence
-Wireless Technology
-Industrial Control
-Internet of Things
-5G Technology
-Medical Equipment

Request XC3SD3400A-4FGG676C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

XC3SD3400A-4FGG676C FAQ Chips 

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Does the price of XC3SD3400A-4FGG676C devices fluctuate frequently?
A: The RAYPCB search engine monitors the XC3SD3400A-4FGG676C inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

Q: Do I have to sign up on the website to make an inquiry for XC3SD3400A-4FGG676C?
A: No, only submit the quantity, email address and other contact information required for the inquiry of XC3SD3400A-4FGG676C, but you need to sign up for the post comments and resource downloads.

Q: How to obtain XC3SD3400A-4FGG676C technical support documents?
A: Enter the “XC3SD3400A-4FGG676C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: Where can I purchase Xilinx XC3SD3400A Development Boards, Evaluation Boards, or Spartan-3A DSP FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: What should I do if I did not receive the technical support for XC3SD3400A4FGG676C in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XC3SD3400A-4FGG676C pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

ICs XC3SD3400A-4FGG676C Features

• Hierarchical SelectRAM memory architecture
• Common footprints support easy density migration
• Densities up to 53712 logic cells, including optional shift register
• Load multiple bitstreams under FPGA control
• 250 MHz XtremeDSP DSP48A Slices
• Fully compliant 32-/64-bit, 33/66 MHz PCI support
• Enhanced Double Data Rate (DDR) support
• Clock skew elimination (delay locked loop)
• MicroBlaze and PicoBlaze embedded processor cores
• DDR/DDR2 SDRAM support up to 333 Mb/s
• Unique Device DNA identifier for design authentication
• Optional cascaded Multiply or MAC
• Low-power option reduces quiescent current
• Full 3.3V ± 10% compatibility and hot swap compliance
• Dedicated 18-bit by 18-bit multiplier
• Suspend, Hibernate modes reduce system power
• Configuration interface to industry-standard PROMs
• Very low cost, high-performance DSP solution for high-volume, cost-conscious applications
• x8 or x8/x16 BPI parallel NOR Flash PROM
• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing
• Wide frequency range (5 MHz to over 320 MHz)
• Eight Digital Clock Managers (DCMs)
• Efficient wide multiplexers, wide logic, fast carry logic
• BGA and CSP packaging with Pb-free options
• Frequency synthesis, multiplication, division
• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling
• Selectable output drive, up to 24 mA per pin
• LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O
• IEEE 1149.1/1532 JTAG programming/debug port
• 622+ Mb/s data transfer rate per differential I/O
• Multi-voltage, multi-standard SelectIO interface pins
• Integrated 18-bit pre-adder
• Low-cost, space-saving SPI serial Flash PROM
• Up to 519 I/O pins or 227 differential signal pairs
• High-resolution phase shifting
• Integrated adder for complex multiply or multiply-add operation
• Registered outputs on the block RAM with operation of at least 280 MHz in the standard -4 speed grade
• Up to 2268 Kbits of fast block RAM with byte write enables for processor applications
• QUIETIO standard reduces I/O switching noise
• XA Automotive version available
• Available pipeline stages for enhanced performance of at least 250 MHz in the standard -4 speed grade
• Dual-range VCCAUX supply simplifies 3.3V-only design
• Up to 373 Kbits of efficient distributed RAM
• Low-cost Xilinx Platform Flash with JTAG
• Abundant, flexible logic resources
• 48-bit accumulator for multiply-accumulate (MAC) operation
• Post-configuration CRC checking
• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors

Request XC3SD3400A-4FGG676C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now

Xilinx XC3SD3400A-4FGG676C Overview

Features

• Very low cost, high-performance DSP solution for high-volume, cost-conscious applications

• 250 MHz XtremeDSP DSP48A Slices

• Dedicated 18-bit by 18-bit multiplier

• Available pipeline stages for enhanced performance of at least 250 MHz in the standard -4 speed grade

• 48-bit accumulator for multiply-accumulate (MAC) operation

• Integrated adder for complex multiply or multiply-add operation

• Integrated 18-bit pre-adder

• Optional cascaded Multiply or MAC

• Hierarchical SelectRAM™ memory architecture

• Up to 2268 Kbits of fast block RAM with byte write enables for processor applications

• Up to 373 Kbits of efficient distributed RAM

• Registered outputs on the block RAM with operation of at least 280 MHz in the standard -4 speed grade

• Dual-range VCCAUX supply simplifies 3.3V-only design

• Suspend, Hibernate modes reduce system power

• Low-power option reduces quiescent current

• Multi-voltage, multi-standard SelectIO™ interface pins

• Up to 519 I/O pins or 227 differential signal pairs

• LVCMOS, LVTTL, HSTL, and SSTL single-ended I/O

• 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling

• Selectable output drive, up to 24 mA per pin

• QUIETIO standard reduces I/O switching noise

• Full 3.3V ± 10% compatibility and hot swap compliance

• 622+ Mb/s data transfer rate per differential I/O

• LVDS, RSDS, mini-LVDS, HSTL/SSTL differential I/O with integrated differential termination resistors

• Enhanced Double Data Rate (DDR) support

• DDR/DDR2 SDRAM support up to 333 Mb/s

• Fully compliant 32-/64-bit, 33/66 MHz PCI support

• Abundant, flexible logic resources

• Densities up to 53712 logic cells, including optional shift register

• Efficient wide multiplexers, wide logic, fast carry logic

• IEEE 1149.1/1532 JTAG programming/debug port

• Eight Digital Clock Managers (DCMs)

• Clock skew elimination (delay locked loop)

• Frequency synthesis, multiplication, division

• High-resolution phase shifting

• Wide frequency range (5 MHz to over 320 MHz)

• Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing

• Configuration interface to industry-standard PROMs

• Low-cost, space-saving SPI serial Flash PROM

• x8 or x8/x16 BPI parallel NOR Flash PROM

• Low-cost Xilinx® Platform Flash with JTAG

• Unique Device DNA identifier for design authentication

• Load multiple bitstreams under FPGA control

• Post-configuration CRC checking

• MicroBlaze™ and PicoBlaze™ embedded processor cores

• BGA and CSP packaging with Pb-free options

• Common footprints support easy density migration

• XA Automotive version available

The Xilinx FPGAs series XC3SD3400A-4FGG676C is FPGA Spartan-3A DSP Family 3.4M Gates 53712 Cells 667MHz 90nm Technology 1.2V , View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC3SD3400A-4FGG676C Tags integrated circuit

1. Spartan-3A DSP FPGA evaluation kit
2. Xilinx XC3SD3400A
3. XC3SD3400A-4FGG676C Datasheet PDF
4. XC3SD3400A development board
5. Spartan-3A DSP FPGA XC3SD3400A
6. Xilinx Spartan-3A DSP FPGA development board
7. Spartan-3A DSP FPGA starter kit
8. XC3SD3400A reference design
9. XC3SD3400A development board

Xilinx XC3SD3400A-4FGG676C TechnicalAttributes

-Number of Gates 3400000
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Voltage – Supply 1.14V ~ 1.26V
-Total RAM Bits 2322432
-Package / Case 676-BGA
-Number of Logic Elements/Cells 53712
-Number of I/O 469

-Supplier Device Package 676-FBGA (27×27)
-Number of LABs/CLBs 5968

-Mounting Type Surface Mount