XC5VLX330-1FFG1760C ApplicationField
-Medical Equipment
-Cloud Computing
-Internet of Things
-5G Technology
-Wireless Technology
-Artificial Intelligence
-Industrial Control
-Consumer Electronics
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XC5VLX330-1FFG1760C FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs XC5VLX330-1FFG1760C Features
High-performance parallel SelectIO technology
Flexible fine-grained I/O banking
LXT, SXT, and FXT devices are footprint compatible in the same package using adjustable voltage regulators
Dual 5-LUT option
JTAG access to all monitored quantities
RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s
On-chip/Off-chip power supply monitoring
7-stage pipeline
High signal-integrity flip-chip packaging available in standard or Pb-free package options
Optimized processor interface structure (crossbar)
Digitally-controlled impedance (DCI) active termination
Source-synchronous interfacing using ChipSync technology
64-bit distributed RAM option
High-speed memory interface support
System Monitoring capability on all devices
On-chip/Off-chip thermal monitoring
SRL32/Dual SRL16 option
Powerful clock management tile (CMT) clocking
32-Kbyte instruction and data caches included
Most advanced, high-performance, optimal-utilization, FPGA fabric
Improved reduced-hop routing
36-Kbit block RAM/FIFOs
FXT Platform only
1.0V core voltage
Real 6-input look-up table (LUT) technology
Integrated Endpoint blocks for PCI Express Designs
Cross-platform compatibility
TXT and FXT Platforms
Advanced DSP48E slices
Flexible configuration options
PowerPC 440 Microprocessors
RISC architecture
1.2 to 3.3V I/O Operation
65-nm copper CMOS process technology
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Xilinx XC5VLX330-1FFG1760C Overview
Using the second generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the XC5VLX330-1FFG1760C contains five distinct platforms (sub-families), the most choice offered by any FPGA family. Each platform contains a different ratio of features to address the needs of a wide variety of advanced logic designs. In addition to the most advanced, high-performance logic fabric, XC5VLX330-1FFG1760C FPGAs contain many hard-IP system level blocks, including powerful 36-Kbit block RAM/FIFOs, second generation 25 x 18 DSP slices, SelectIO technology with built-in digitally-controlled impedance, ChipSync source-synchronous interface blocks, system monitor functionality,
The Xilinx FPGAs (Field Programmable Gate Array) series XC5VLX330-1FFG1760C is Virtex-5 Multi-Platform FPGAs, Package: 1FFG1760C, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC5VLX330-1FFG1760C Tags integrated circuit
1. Virtex-5 FPGA XC5VLX330
2. XC5VLX330-1FFG1760C Datasheet PDF
3. Xilinx Virtex-5 FPGA development board
4. XC5VLX330 development board
5. Virtex-5 FPGA starter kit
6. Xilinx XC5VLX330
7. Virtex-5 FPGA evaluation kit
8. XC5VLX330 evaluation board
9. XC5VLX330 development board
Xilinx XC5VLX330-1FFG1760C TechnicalAttributes
-Supplier Device Package 1760-FCBGA (42.5×42.5)
-Mounting Type Surface Mount
-Number of I/O 1200
-Voltage – Supply 0.95V ~ 1.05V
-Number of LABs/CLBs 25920
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Total RAM Bits 10616832
-Package / Case 1760-BBGA, FCBGA
-Number of Logic Elements/Cells 331776
