XC5VLX50-3FFG676C -Medical Equipment -Cloud Computing

XC5VLX50-3FFG676C ApplicationField

-Consumer Electronics
-Industrial Control
-Wireless Technology
-5G Technology
-Internet of Things
-Cloud Computing
-Artificial Intelligence
-Medical Equipment

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XC5VLX50-3FFG676C FAQ Chips 

Q: What should I do if I did not receive the technical support for XC5VLX503FFG676C in time?
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Q: Where can I purchase Xilinx XC5VLX50 Development Boards, Evaluation Boards, or Virtex-5 FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How to obtain XC5VLX50-3FFG676C technical support documents?
A: Enter the “XC5VLX50-3FFG676C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: Does the price of XC5VLX50-3FFG676C devices fluctuate frequently?
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ICs XC5VLX50-3FFG676C Features

RocketIO GTX transceivers 150 Mb/s to 6.5 Gb/s
65-nm copper CMOS process technology
Digitally-controlled impedance (DCI) active termination
TXT and FXT Platforms
Source-synchronous interfacing using ChipSync technology
System Monitoring capability on all devices
LXT and SXT Platforms
Most advanced, high-performance, optimal-utilization, FPGA fabric
36-Kbit block RAM/FIFOs
1.0V core voltage
PowerPC 440 Microprocessors
Integrated Endpoint blocks for PCI Express Designs
On-chip/Off-chip power supply monitoring
RocketIO GTP transceivers 100 Mb/s to 3.75 Gb/s
Five platforms LX, LXT, SXT, TXT, and FXT
High signal-integrity flip-chip packaging available in standard or Pb-free package options
JTAG access to all monitored quantities
Cross-platform compatibility
1.2 to 3.3V I/O Operation
Powerful clock management tile (CMT) clocking
LXT, SXT, and FXT devices are footprint compatible in the same package using adjustable voltage regulators
High-performance parallel SelectIO technology
On-chip/Off-chip thermal monitoring
High-speed memory interface support
Flexible fine-grained I/O banking

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Xilinx XC5VLX50-3FFG676C Overview

Using the second generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the XC5VLX50-3FFG676C contains five distinct platforms (sub-families), the most choice offered by any FPGA family. Each platform contains a different ratio of features to address the needs of a wide variety of advanced logic designs. In addition to the most advanced, high-performance logic fabric, XC5VLX50-3FFG676C FPGAs contain many hard-IP system level blocks, including powerful 36-Kbit block RAM/FIFOs, second generation 25 x 18 DSP slices, SelectIO technology with built-in digitally-controlled impedance, ChipSync source-synchronous interface blocks, system monitor functionality, 
The Xilinx FPGAs (Field Programmable Gate Array) series XC5VLX50-3FFG676C is FPGA Virtex-5 LX Family 46080 Cells 65nm (CMOS) Technology 1V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC5VLX50-3FFG676C Tags integrated circuit

1. XC5VLX50 reference design
2. XC5VLX50 evaluation board
3. Virtex-5 FPGA starter kit
4. Xilinx Virtex-5 FPGA development board
5. XC5VLX50-3FFG676C Datasheet PDF
6. XC5VLX50 development board
7. Virtex-5 FPGA XC5VLX50
8. Virtex-5 FPGA evaluation kit
9. Xilinx Virtex-5 FPGA development board

Xilinx XC5VLX50-3FFG676C TechnicalAttributes

-Total RAM Bits 1769472
-Voltage – Supply 0.95V ~ 1.05V
-Number of I/O 440
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 46080
-Number of LABs/CLBs 3600
-Operating Temperature 0℃ ~ 85℃ (TJ)

-Supplier Device Package 676-FCBGA (27×27)
-Package / Case 676-BBGA, FCBGA

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