-Internet of Things
XC6SLX100-3FGG676I FAQ Chips
Q: Do I have to sign up on the website to make an inquiry for XC6SLX100-3FGG676I?
A: No, only submit the quantity, email address and other contact information required for the inquiry of XC6SLX100-3FGG676I, but you need to sign up for the post comments and resource downloads.
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Does the price of XC6SLX100-3FGG676I devices fluctuate frequently?
A: The RAYPCB search engine monitors the XC6SLX100-3FGG676I inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
Q: Where can I purchase Xilinx XC6SLX100 Development Boards, Evaluation Boards, or Spartan 6 FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How to obtain XC6SLX100-3FGG676I technical support documents?
A: Enter the “XC6SLX100-3FGG676I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: What should I do if I did not receive the technical support for XC6SLX1003FGG676I in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XC6SLX100-3FGG676I pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.
ICs XC6SLX100-3FGG676I Features
Phase-Locked Loops (PLLs) for low-jitter clocking
2-pin auto-detect configuration
Up to 1,080 Mb/s data transfer rate per differential I/O
3.3V to 1.2V I/O standards and protocols
Sixteen low-skew global clock networks
High-speed interfaces including: Serial ATA, Aurora, 1G Ethernet, PCI Express, OBSAI, CPRI, EPON, GPON, DisplayPort, and XAUI
Simplified configuration, supports low-cost standards
18 Kb blocks that can be optionally programmed as two independent 9 Kb block RAMs
High-performance arithmetic and signal processing
Broad third-party SPI (up to x4) and NOR flash support
MultiBoot support for remote upgrade with multiple bitstreams, using watchdog protection
Multi-voltage, multi-standard SelectIO interface banks
High-speed GTP serial transceivers in the LXT FPGAs
Efficient DSP48A1 slices
Designed for low cost
Enhanced security for design protection
Frequency synthesis with simultaneous multiplication, division, and phase shifting
Up to 3.2 Gb/s
Low-cost HSTL and SSTL memory interfaces
Clock Management Tile (CMT) for enhanced performance
Unique Device DNA identifier for design authentication
Industry-leading IP and reference designs
Adjustable I/O slew rates to improve signal integrity
Low static and dynamic power
Block RAM with a wide range of granularity
Low noise, flexible clocking
Integrated Endpoint block for PCI Express designs (LXT)
Pipelining and cascading capability
Low-cost PCI technology support compatible with the 33 MHz, 32- and 64-bit specification.
Hot swap compliance
Digital Clock Managers (DCMs) eliminate clock skew and duty cycle distortion
Fast 18 x 18 multiplier and 48-bit accumulator
Feature rich Xilinx Platform Flash with JTAG
Faster embedded processing with enhanced, low cost, MicroBlaze soft processor
Selectable output drive, up to 24 mA per pin
AES bitstream encryption in the larger devices
Fast block RAM with byte write enable
Pre-adder to assist filter applications
Request XC6SLX100-3FGG676I FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XC6SLX100-3FGG676I Overview
Built on a mature 45 nm low-power copper process technology that delivers the optimal balance of cost, power, and performance, the XC6SLX100-3FGG676I offers a new, more efficient, dual-register 6-input lookup table (LUT) logic and a rich selection of built-in system-level blocks. These include 18 Kb (2 x 9 Kb) block RAMs, second generation DSP48A1 slices, SDRAM memory controllers, enhanced mixed-mode clock management blocks, SelectIO technology, poweroptimized high-speed serial transceiver blocks, PCI Express compatible Endpoint blocks, advanced system-level power management modes, auto-detect configuration options, and enhanced IP security with AES and Device DNA protection. These features provide a lowcost programmable alternative to custom ASIC products with unprecedented ease of use. XC6SLX100-3FGG676I FPGAs offer the best solution for high-volume logic designs, consumer-oriented DSP designs, and cost-sensitive embedded applications. Spartan-6 XC6SLX100-3FGG676I FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components that enable designers to focus on innovation as soon as their development cycle begins.
The Xilinx FPGAs (Field Programmable Gate Array) series XC6SLX100-3FGG676I is Spartan-6 LX Family 101261 Cells 45nm (CMOS) Technology 1.2V, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC6SLX100-3FGG676I Tags integrated circuit
1. XC6SLX100 development board
2. XC6SLX100 evaluation board
3. Spartan-6 FPGAs starter kit
4. Xilinx XC6SLX100
5. XC6SLX100 reference design
6. XC6SLX100-3FGG676I Datasheet PDF
7. Spartan-6 FPGAs XC6SLX100
8. Xilinx Spartan-6 FPGAs development board
9. Xilinx XC6SLX100
Xilinx XC6SLX100-3FGG676I TechnicalAttributes
-Supplier Device Package 676-FBGA (27×27)
-Number of LABs/CLBs 7911
-Mounting Type Surface Mount
-Total RAM Bits 4939776
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 480
-Package / Case 676-BGA
-Number of Logic Elements/Cells 101261
-Voltage – Supply 1.14V ~ 1.26V