XC6VSX315T-3FFG1156C ApplicationField
-Wireless Technology
-5G Technology
-Medical Equipment
-Consumer Electronics
-Internet of Things
-Industrial Control
-Cloud Computing
-Artificial Intelligence
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XC6VSX315T-3FFG1156C FAQ Chips
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ICs XC6VSX315T-3FFG1156C Features
Lower-power 0.9V core voltage option (-1L speed grade only)
System Monitor capability on all devices
36-Kb block RAM/FIFOs
Dual LUT5 (5-input LUT) option
Flexible configuration options
Improved routing efficiency
MMCM blocks provide zero-delay buffering, frequency synthesis, clock-phase shifting, inputjitter filtering, and phase-matched clock division
Optional bitwise logic functionality
1.0V core voltage (-1, -2, -3 speed grades only)
Multi-bitstream support with dedicated fallback reconfiguration logic
Three sub-families:
LUT/dual flip-flop pair for applications requiring rich register mix
New optional pre-adder to assist filtering applications
GTX transceivers: up to 6.6 Gb/s
Advanced DSP48E1 slices
LXT and SXT devices are footprint compatible in the same package
SRL32/dual SRL16 with registered outputs option
Gen1 (2.5 Gb/s) and Gen2 (5 Gb/s) support with GTX transceivers
Dedicated cascade connections
Optional pipelining
Advanced, high-performance FPGA Logic
Endpoint and Root Port capable
64-bit (or two 32-bit) distributed LUT RAM option per 6-input LUT
X1, x2, x4, or x8 lane support per block
SPI and Parallel Flash interface
40 nm copper CMOS process technology
Data rates below 480 Mb/s supported by oversampling in FPGA logic.
Integrated 10/100/1000 Mb/s Ethernet MAC block
GTH transceivers: 2.488 Gb/s to beyond 11 Gb/s
Automatic bus width detection
25 x 18, two`s complement multiplier/accumulator
High signal-integrity flip-chip packaging available in standard or Pb-free package options
Real 6-input look-up table (LUT) technology
Powerful mixed-mode clock managers (MMCM)
Compliant to the PCI Express Base Specification 2.0
Integrated interface blocks for PCI Express designs
Compatibility across sub-families
Virtex-6 HXT FPGAs: Highest bandwidth serial connectivity
Virtex-6 LXT FPGAs: High-performance logic with advanced serial connectivity
Virtex-6 SXT FPGAs: Highest signal processing capability with advanced serial connectivity
High-performance parallel SelectIO technology
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Xilinx XC6VSX315T-3FFG1156C Overview
The XC6VSX315T-3FFG1156C FPGAs are the programmable silicon foundation for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins. Using the third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture, the Xilinx XC6VSX315T-3FFG1156C contain many builtin system-level blocks. These features allow logic designers to build the highest levels of performance and functionality into their FPGAbased systems. Built on a 40 nm state-of-the-art copper process technology, XC6VSX315T-3FFG1156C FPGAs are a programmable alternative to custom ASIC technology. offer the best solution for addressing the needs of high-performance logic designers, high-performance DSP designers, and high-performance embedded systems designers with unprecedented logic, DSP, connectivity, and soft microprocessor capabilities.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC6VSX315T-3FFG1156C is CONN H4 MALE 8mm², View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC6VSX315T-3FFG1156C Tags integrated circuit
1. XC6VSX315T development board
2. XC6VSX315T evaluation board
3. Virtex-6 FPGA starter kit
4. Virtex-6 FPGA XC6VSX315T
5. XC6VSX315T-3FFG1156C Datasheet PDF
6. Xilinx XC6VSX315T
7. Virtex-6 FPGA evaluation kit
8. Xilinx Virtex-6 FPGA development board
9. Virtex-6 FPGA XC6VSX315T
Xilinx XC6VSX315T-3FFG1156C TechnicalAttributes
-Mounting Type Surface Mount
-Package / Case 1156-BBGA, FCBGA
-Number of Logic Elements/Cells 314880
-Total RAM Bits 25952256
-Number of I/O 600
-Number of LABs/CLBs 24600
-Voltage – Supply 0.95V ~ 1.05V
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Supplier Device Package 1156-FCBGA (35×35)
