XC7VX415T-2FFG1157C ApplicationField
-Medical Equipment
-Consumer Electronics
-Wireless Technology
-Internet of Things
-Cloud Computing
-Artificial Intelligence
-5G Technology
-Industrial Control
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XC7VX415T-2FFG1157C FAQ Chips
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ICs XC7VX415T-2FFG1157C Features
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Full-range extended temperature testing
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
4th Generation Information Assurance and Anti-tamper support.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Ruggedized packaging
Mask set control
Long-term availability
Fully leaded (Pb) content
Anti-counterfeiting features
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
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Xilinx XC7VX415T-2FFG1157C Overview
Xilinx XC7VX415T-2FFG1157C FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VX415T-2FFG1157C FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
The Xilinx FPGAs (Field Programmable Gate Array) series XC7VX415T-2FFG1157C is Virtex-7 FPGA 600 I/O 1157FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC7VX415T-2FFG1157C Tags integrated circuit
1. XC7VX415T development board
2. Virtex-7 FPGAs starter kit
3. XC7VX415T reference design
4. Xilinx Virtex-7 FPGAs development board
5. Virtex-7 FPGAs XC7VX415T
6. XC7VX415T-2FFG1157C Datasheet PDF
7. Xilinx XC7VX415T
8. XC7VX415T evaluation board
9. Xilinx Virtex-7 FPGAs development board
Xilinx XC7VX415T-2FFG1157C TechnicalAttributes
-Supplier Device Package 1157-FCBGA (35×35)
-Number of LABs/CLBs 32200
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Package / Case 1156-BBGA, FCBGA
-Number of Logic Elements/Cells 412160
-Voltage – Supply 0.97V ~ 1.03V
-Mounting Type Surface Mount
-Number of I/O 600
-Total RAM Bits 32440320
