XC7VX415T-3FFG1157E ApplicationField
-Wireless Technology
-Internet of Things
-5G Technology
-Cloud Computing
-Artificial Intelligence
-Medical Equipment
-Consumer Electronics
-Industrial Control
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XC7VX415T-3FFG1157E FAQ Chips
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ICs XC7VX415T-3FFG1157E Features
Long-term availability
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Full-range extended temperature testing
Mask set control
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
4th Generation Information Assurance and Anti-tamper support.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Fully leaded (Pb) content
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Ruggedized packaging
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Anti-counterfeiting features
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Xilinx XC7VX415T-3FFG1157E Overview
Xilinx XC7VX415T-3FFG1157E FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VX415T-3FFG1157E FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC7VX415T-3FFG1157E is Virtex-7 FPGA 600 I/O 1157FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC7VX415T-3FFG1157E Tags integrated circuit
1. Virtex-7 FPGAs XC7VX415T
2. Virtex-7 FPGAs starter kit
3. XC7VX415T evaluation board
4. XC7VX415T-3FFG1157E Datasheet PDF
5. Xilinx Virtex-7 FPGAs development board
6. XC7VX415T development board
7. XC7VX415T reference design
8. Virtex-7 FPGAs evaluation kit
9. XC7VX415T-3FFG1157E Datasheet PDF
Xilinx XC7VX415T-3FFG1157E TechnicalAttributes
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Number of Logic Elements/Cells 412160
-Package / Case 1156-BBGA, FCBGA
-Voltage – Supply 0.97V ~ 1.03V
-Mounting Type Surface Mount
-Supplier Device Package 1157-FCBGA (35×35)
-Total RAM Bits 32440320
-Number of LABs/CLBs 32200
-Number of I/O 600
