XC7VX485T-1FF1157C -Medical Equipment -5G Technology

XC7VX485T-1FF1157C ApplicationField

-Industrial Control
-Consumer Electronics
-Internet of Things
-Wireless Technology
-Cloud Computing
-5G Technology
-Artificial Intelligence
-Medical Equipment

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XC7VX485T-1FF1157C FAQ Chips 

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A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

ICs XC7VX485T-1FF1157C Features

Fully leaded (Pb) content
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.

Full-range extended temperature testing
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.

DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Ruggedized packaging
Mask set control

Long-term availability

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Xilinx XC7VX485T-1FF1157C Overview

Xilinx XC7VX485T-1FF1157C FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VX485T-1FF1157C FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

XC7VX485T-1FF1157C Tags integrated circuit

1. XC7VX485T evaluation board
2. Virtex-7 FPGAs XC7VX485T
3. Xilinx Virtex-7 FPGAs development board
4. XC7VX485T-1FF1157C Datasheet PDF
5. Xilinx XC7VX485T
6. XC7VX485T development board
7. Virtex-7 FPGAs evaluation kit
8. Virtex-7 FPGAs starter kit
9. XC7VX485T-1FF1157C Datasheet PDF

Xilinx XC7VX485T-1FF1157C TechnicalAttributes

-Mounting Type Surface Mount
-Supplier Device Package 1157-FCBGA (35×35)
-Package / Case 1156-BBGA, FCBGA
-Voltage – Supply 0.97V ~ 1.03V
-Total RAM Bits 37969920
-Number of LABs/CLBs 37950
-Number of I/O 600

-Number of Logic Elements/Cells 485760
-Operating Temperature 0℃ ~ 85℃ (TJ)