XC7VX485T-2FF1761C -5G Technology -Cloud Computing

XC7VX485T-2FF1761C ApplicationField

-Industrial Control
-Artificial Intelligence
-Internet of Things
-Medical Equipment
-Wireless Technology
-Cloud Computing
-Consumer Electronics
-5G Technology

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XC7VX485T-2FF1761C FAQ Chips 

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Does the price of XC7VX485T-2FF1761C devices fluctuate frequently?
A: The RAYPCB search engine monitors the XC7VX485T-2FF1761C inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

Q: How to obtain XC7VX485T-2FF1761C technical support documents?
A: Enter the “XC7VX485T-2FF1761C” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

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Q: Where can I purchase Xilinx XC7VX485T Development Boards, Evaluation Boards, or Virtex-7 FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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A: No, only submit the quantity, email address and other contact information required for the inquiry of XC7VX485T-2FF1761C, but you need to sign up for the post comments and resource downloads.

ICs XC7VX485T-2FF1761C Features

Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Mask set control
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Full-range extended temperature testing

Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Fully leaded (Pb) content

DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Long-term availability
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.

Ruggedized packaging

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Xilinx XC7VX485T-2FF1761C Overview

Xilinx XC7VX485T-2FF1761C FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VX485T-2FF1761C FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.

XC7VX485T-2FF1761C Tags integrated circuit

1. XC7VX485T evaluation board
2. XC7VX485T development board
3. Xilinx XC7VX485T
4. Virtex-7 FPGAs starter kit
5. XC7VX485T-2FF1761C Datasheet PDF
6. Virtex-7 FPGAs evaluation kit
7. Xilinx Virtex-7 FPGAs development board
8. XC7VX485T reference design
9. Virtex-7 FPGAs starter kit

Xilinx XC7VX485T-2FF1761C TechnicalAttributes

-Number of I/O 700
-Number of Logic Elements/Cells 485760
-Package / Case 1760-BBGA, FCBGA
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Total RAM Bits 37969920
-Mounting Type Surface Mount
-Number of LABs/CLBs 37950

-Supplier Device Package 1761-FCBGA (42.5×42.5)
-Voltage – Supply 0.97V ~ 1.03V

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