XC7VX550T-1FFG1927C ApplicationField
-Medical Equipment
-Consumer Electronics
-Wireless Technology
-Internet of Things
-5G Technology
-Industrial Control
-Artificial Intelligence
-Cloud Computing
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XC7VX550T-1FFG1927C FAQ Chips
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ICs XC7VX550T-1FFG1927C Features
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
Integrated block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Wire-bond and high signal integrity lidded flip-chip ruggedized packages offering easy migration between family members in the same package. All packages are available in Pb option.
Fully leaded (Pb) content
Full-range extended temperature testing
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
Designed for high performance and lowest power with 28 nm, HKMG, and HPL process.
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Long-term availability
Anti-counterfeiting features
Ruggedized packaging
4th Generation Information Assurance and Anti-tamper support
Mask set control
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
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Xilinx XC7VX550T-1FFG1927C Overview
Xilinx XC7VX550T-1FFG1927C FPGAs address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the high reliability requirements beyond commercial applications.Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7VX550T-1FFG1927C FPGAs enable an unparalleled increase in system performance with 1.4 Tb/s of I/O bandwidth, 980K logic cell capacity, and 4.7 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XC7VX550T-1FFG1927C is Virtex-7 FPGA 600 I/O 1927FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XC7VX550T-1FFG1927C Tags integrated circuit
1. Virtex-7 FPGAs evaluation kit
2. XC7VX550T development board
3. Xilinx Virtex-7 FPGAs development board
4. Virtex-7 FPGAs starter kit
5. Xilinx XC7VX550T
6. XC7VX550T reference design
7. XC7VX550T-1FFG1927C Datasheet PDF
8. XC7VX550T evaluation board
9. Virtex-7 FPGAs starter kit
Xilinx XC7VX550T-1FFG1927C TechnicalAttributes
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Mounting Type Surface Mount
-Total RAM Bits 43499520
-Package / Case 1924-BBGA, FCBGA
-Number of Logic Elements/Cells 554240
-Number of LABs/CLBs 43300
-Supplier Device Package 1927-FCBGA (45×45)
-Number of I/O 600
-Voltage – Supply 0.97V ~ 1.03V