XC7Z045-3FBG676E -Internet of Things -Consumer Electronics

XC7Z045-3FBG676E ApplicationField

-Industrial Control
-5G Technology
-Medical Equipment
-Wireless Technology
-Cloud Computing
-Consumer Electronics
-Artificial Intelligence
-Internet of Things

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XC7Z045-3FBG676E FAQ Chips 

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: Where can I purchase Xilinx XC7Z045 Development Boards, Evaluation Boards, or Zynq-7000 SoC Starter Kit? also provide technical information?
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Q: How to obtain XC7Z045-3FBG676E technical support documents?
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ICs XC7Z045-3FBG676E Features

• Cascadeable adders
• Up to 72 bits wide
• Programmable I/O delay and SerDes
                                               
• Configurable as dual 18 Kb block RAM
DSP Blocks
Configurable Logic Blocks (CLB)
• True Dual-Port
Programmable I/O Blocks
• 18 x 25 signed multiply
• 25-bit pre-adder
• 48-bit adder/accumulator
• Supports LVCMOS, LVDS, and SSTL

• Look-up tables (LUT)
36 Kb Block RAM

• 1.2V to 3.3V I/O
• Flip-flops

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Xilinx XC7Z045-3FBG676E Overview

The Zynq-7000 family XC7Z045-3FBG676E is based on the Xilinx SoC architecture. These products integrate a feature-rich dual-core or single-core ARM Cortex-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.The XC7Z045-3FBG676E SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL) VCCINT/VCCBRAM = 0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq XC7Z045-3FBG676E  device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications.
The Xilinx Embedded – System On Chip (SoC) series XC7Z045-3FBG676E is Zynq-7000 SOC CORTEX-A9 1GHZ 676FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC7Z045-3FBG676E Tags integrated circuit

1. Xilinx Zynq-7000 SoC development board
2. Zynq-7000 SoC evaluation kit
3. Zynq-7000 SoC starter kit
4. XC7Z045 evaluation board
5. XC7Z045-3FBG676E Datasheet PDF
6. Xilinx XC7Z045
7. Zynq-7000 SoC XC7Z045
8. XC7Z045 reference design
9. XC7Z045 evaluation board

Xilinx XC7Z045-3FBG676E TechnicalAttributes

-Operating Temperature 0℃ ~ 100℃ (TJ)
-Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-Speed 1GHz
-RAM Size 256KB
-Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
-Peripherals DMA
-Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

-Supplier Device Package 676-FCBGA (27×27)
-Architecture MCU, FPGA

-Package / Case 676-BBGA, FCBGA