XC7Z045-3FFV676E -5G Technology -Artificial Intelligence

XC7Z045-3FFV676E ApplicationField

-Consumer Electronics
-Medical Equipment
-Internet of Things
-Cloud Computing
-Wireless Technology
-Artificial Intelligence
-Industrial Control
-5G Technology

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XC7Z045-3FFV676E FAQ Chips 

Q: Does the price of XC7Z045-3FFV676E devices fluctuate frequently?
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Q: Where can I purchase Xilinx XC7Z045 Development Boards, Evaluation Boards, or Zynq-7000 SoC Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

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Q: How to obtain XC7Z045-3FFV676E technical support documents?
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ICs XC7Z045-3FFV676E Features

• Look-up tables (LUT)
Programmable I/O Blocks
36 Kb Block RAM
• 25-bit pre-adder
• Up to 72 bits wide
DSP Blocks
• 18 x 25 signed multiply
• Supports LVCMOS, LVDS, and SSTL
• 1.2V to 3.3V I/O
• True Dual-Port
• Configurable as dual 18 Kb block RAM
• Programmable I/O delay and SerDes

• 48-bit adder/accumulator
• Cascadeable adders

• Flip-flops
Configurable Logic Blocks (CLB)

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Xilinx XC7Z045-3FFV676E Overview

The Zynq-7000 family XC7Z045-3FFV676E is based on the Xilinx SoC architecture. These products integrate a feature-rich dual-core or single-core ARM Cortex-A9 based processing system (PS) and 28 nm Xilinx programmable logic (PL) in a single device. The ARM Cortex-A9 CPUs are the heart of the PS and also include on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.The XC7Z045-3FFV676E SoCs are available in -3, -2, -2LI, -1, and -1LQ speed grades, with -3 having the highest performance. The -2LI devices operate at programmable logic (PL) VCCINT/VCCBRAM = 0.95V and are screened for lower maximum static power. The speed specification of a -2LI device is the same as that of a -2 device. The -1LQ devices operate at the same voltage and speed as the -1Q devices and are screened for lower power. Zynq XC7Z045-3FFV676E  device DC and AC characteristics are specified in commercial, extended, industrial, and expanded (Q-temp) temperature ranges. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade industrial device are the same as for a -1 speed grade commercial device). However, only selected speed grades and/or devices are available in the commercial, extended, or industrial temperature ranges. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications.
The Xilinx Embedded – System On Chip (SoC) series XC7Z045-3FFV676E is Zynq-7000 SOC CORTEX-A9 1GHZ 676FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XC7Z045-3FFV676E Tags integrated circuit

1. Xilinx Zynq-7000 SoC development board
2. XC7Z045 evaluation board
3. Xilinx XC7Z045
4. XC7Z045 development board
5. Zynq-7000 SoC starter kit
6. XC7Z045-3FFV676E Datasheet PDF
7. XC7Z045 reference design
8. Zynq-7000 SoC XC7Z045
9. XC7Z045 development board

Xilinx XC7Z045-3FFV676E TechnicalAttributes

-Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
-Primary Attributes Kintex?-7 FPGA, 350K Logic Cells
-Architecture MCU, FPGA
-Package / Case 676-BBGA, FCBGA
-Core Processor Dual ARM? Cortex?-A9 MPCore? with CoreSight?
-Peripherals DMA
-Supplier Device Package 676-FCBGA (27×27)

-Operating Temperature 0℃ ~ 100℃ (TJ)
-RAM Size 256KB

-Speed 1GHz