XCKU040-2FBVA676E -Wireless Technology -Internet of Things

XCKU040-2FBVA676E ApplicationField

-Consumer Electronics
-5G Technology
-Artificial Intelligence
-Cloud Computing
-Medical Equipment
-Internet of Things
-Industrial Control
-Wireless Technology

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XCKU040-2FBVA676E FAQ Chips 

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Q: Does the price of XCKU040-2FBVA676E devices fluctuate frequently?
A: The RAYPCB search engine monitors the XCKU040-2FBVA676E inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.

Q: Where can I purchase Xilinx XCKU040 Development Boards, Evaluation Boards, or Kintex UltraScale FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: What should I do if I did not receive the technical support for XCKU0402FBVA676E in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XCKU040-2FBVA676E pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

Q: How to obtain XCKU040-2FBVA676E technical support documents?
A: Enter the “XCKU040-2FBVA676E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

ICs XCKU040-2FBVA676E Features

Processing System

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Xilinx XCKU040-2FBVA676E Overview

Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.The XCKU040-2FBVA676E devices are high-performance FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.The XCKU040-2FBVA676E FPGAs is Based on the UltraScale architecture, these devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex UltraScale XCKU040-2FBVA676E FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XCKU040-2FBVA676E is FPGA, Kintex UltraScale, MMCM, PLL, 312 I/O’s, 725 MHz, 530250 Cells, 922 mV to 979 mV, FCBGA-676, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XCKU040-2FBVA676E Tags integrated circuit

1. Xilinx Kintex UltraScale FPGA development board
2. XCKU040 evaluation board
3. XCKU040 development board
4. Xilinx XCKU040
5. XCKU040-2FBVA676E Datasheet PDF
6. Kintex UltraScale FPGA XCKU040
7. Kintex UltraScale FPGA evaluation kit
8. XCKU040 reference design
9. Xilinx XCKU040

Xilinx XCKU040-2FBVA676E TechnicalAttributes

-Mounting Type Surface Mount
-Voltage – Supply 0.922V ~ 0.979V
-Number of I/O 312
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Supplier Device Package 676-FCBGA (27×27)
-Number of LABs/CLBs 30300
-Package / Case 676-BBGA, FCBGA

-Number of Logic Elements/Cells 530250
-Total RAM Bits 21606000

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