XCKU3P-2FFVB676I ApplicationField
-Cloud Computing
-Wireless Technology
-Artificial Intelligence
-Consumer Electronics
-Medical Equipment
-5G Technology
-Internet of Things
-Industrial Control
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XCKU3P-2FFVB676I FAQ Chips
Q: Does the price of XCKU3P-2FFVB676I devices fluctuate frequently?
A: The RAYPCB search engine monitors the XCKU3P-2FFVB676I inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
Q: What should I do if I did not receive the technical support for XCKU3P2FFVB676I in time?
A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XCKU3P-2FFVB676I pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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A: No, only submit the quantity, email address and other contact information required for the inquiry of XCKU3P-2FFVB676I, but you need to sign up for the post comments and resource downloads.
Q: How to obtain XCKU3P-2FFVB676I technical support documents?
A: Enter the “XCKU3P-2FFVB676I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: Where can I purchase Xilinx XCKU3P Development Boards, Evaluation Boards, or Kintex UltraScale+ FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs XCKU3P-2FFVB676I Features
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Xilinx XCKU3P-2FFVB676I Overview
The Xilinx XCKU3P is available in -3, -2, -1 speed grades, with -3E devices having the highest performance. The -2LE and -1LI devices can operate at a VCCINT voltage at 0.85V or 0.72V and provide lower maximum static power. When operated at VCCINT = 0.85V, using -2LE and -1LI devices, the speed specification for the L devices is the same as the -2I or -1I speed grades. When operated at VCCINT = 0.72V, the-2LE and -1LI performance and static and dynamic power is reduced. DC and AC characteristics are specified in extended (E), industrial (I), and military (M) temperature ranges.Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade extended device are the same as for a -1 speed grade industrial device). However, only selected speed grades and/or devices are available in each temperature range.
XCKU3P: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of
high-performance peripherals and cost-effective system implementation. Kintex UltraScale+ FPGAs have numerous power
options that deliver the optimal balance between the required system performance and the smallest power envelope.
XCKU3P-2FFVB676I Tags integrated circuit
1. XCKU3P evaluation board
2. Kintex UltraScale+ FPGA starter kit
3. XCKU3P-2FFVB676I Datasheet PDF
4. Xilinx XCKU3P
5. XCKU3P reference design
6. Kintex UltraScale+ FPGA evaluation kit
7. Kintex UltraScale+ FPGA XCKU3P
8. Xilinx Kintex UltraScale+ FPGA development board
9. Xilinx XCKU3P
Xilinx XCKU3P-2FFVB676I TechnicalAttributes
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Voltage – Supply 0.825V ~ 0.876V
-Number of I/O 280
-Package / Case 676-BBGA, FCBGA
-Number of LABs/CLBs 20340
-Supplier Device Package 676-FCBGA (27×27)
-Number of Logic Elements/Cells 355950
-Mounting Type Surface Mount
-Total RAM Bits 31641600
