XCKU3P-L2FFVD900E ApplicationField
-Wireless Technology
-Internet of Things
-Industrial Control
-Artificial Intelligence
-Medical Equipment
-Consumer Electronics
-5G Technology
-Cloud Computing
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XCKU3P-L2FFVD900E FAQ Chips
Q: Where can I purchase Xilinx XCKU3P Development Boards, Evaluation Boards, or Kintex UltraScale+ FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs XCKU3P-L2FFVD900E Features
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Xilinx XCKU3P-L2FFVD900E Overview
The Xilinx XCKU3P is available in -3, -2, -1 speed grades, with -3E devices having the highest performance. The -2LE and -1LI devices can operate at a VCCINT voltage at 0.85V or 0.72V and provide lower maximum static power. When operated at VCCINT = 0.85V, using -2LE and -1LI devices, the speed specification for the L devices is the same as the -2I or -1I speed grades. When operated at VCCINT = 0.72V, the-2LE and -1LI performance and static and dynamic power is reduced. DC and AC characteristics are specified in extended (E), industrial (I), and military (M) temperature ranges.Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -1 speed grade extended device are the same as for a -1 speed grade industrial device). However, only selected speed grades and/or devices are available in each temperature range.
XCKU3P: Increased performance and on-chip UltraRAM memory to reduce BOM cost. The ideal mix of
high-performance peripherals and cost-effective system implementation. Kintex UltraScale+ FPGAs have numerous power
options that deliver the optimal balance between the required system performance and the smallest power envelope.
XCKU3P-L2FFVD900E Tags integrated circuit
1. Xilinx Kintex UltraScale+ FPGA development board
2. XCKU3P evaluation board
3. XCKU3P-L2FFVD900E Datasheet PDF
4. Xilinx XCKU3P
5. XCKU3P reference design
6. Kintex UltraScale+ FPGA evaluation kit
7. Kintex UltraScale+ FPGA starter kit
8. Kintex UltraScale+ FPGA XCKU3P
9. Xilinx XCKU3P
Xilinx XCKU3P-L2FFVD900E TechnicalAttributes
-Number of I/O 304
-Number of LABs/CLBs 20340
-Number of Logic Elements/Cells 355950
-Package / Case 900-BBGA, FCBGA
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Supplier Device Package 900-FCBGA (31×31)
-Voltage – Supply 0.698V ~ 0.876V
-Total RAM Bits 31641600
-Mounting Type Surface Mount
