XCR3128XL-10VQG100C ApplicationField
-Cloud Computing
-Artificial Intelligence
-Industrial Control
-Internet of Things
-Medical Equipment
-Consumer Electronics
-5G Technology
-Wireless Technology
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XCR3128XL-10VQG100C FAQ Chips
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ICs XCR3128XL-10VQG100C Features
Foldback NAND for synthesis optimization
Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.
Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
Innovative CoolRunner XPLA3 architecture combines high speed with extreme flexibility
Supports hot-plugging capability
16 product term clocks and four local control term clocks per function block
5V tolerant I/O pins
Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
Fast programming times
3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
Security bit prevents unauthorized access
Typical Standby Current of 17 to 18 μA at 25°C
Four output enable controls per function block
Four global clocks and one universal control term clock per device
Advanced 0.35μ five layer metal EEPROM process
Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
Support for complex asynchronous clocking
Design entry/verification using Xilinx or industry standard CAE tools
Universal 3-state which facilitates “bed of nails” testing
Full Boundary-Scan Test (IEEE 1149.1)
Excellent pin retention during design changes
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Xilinx XCR3128XL-10VQG100C Overview
The XCR3128XL-10VQG100C is targeted for low power systems that include portable, handheld, and power sensitive applications.，includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the XCR3128XL-10VQG100C offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for “turbo bits” or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. XCR3128XL-10VQG100C devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.CoolRunner XPLA3 CPLDs are supported by Xilinx WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.The XCR3128XL-10VQG100C is electrically reprogrammable using industry standard device programmers.
The Xilinx SCM, board series XCR3128XL-10VQG100C is 128 MACROCELL 3.3 VOLT ISP CPLD, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCR3128XL-10VQG100C Tags integrated circuit
1. Macrocell CPLD evaluation kit
2. Xilinx XCR3128XL
3. XCR3128XL-10VQG100C Datasheet PDF
4. XCR3128XL reference design
5. XCR3128XL evaluation board
6. XCR3128XL development board
7. Macrocell CPLD XCR3128XL
8. Xilinx Macrocell CPLD development board
9. XCR3128XL reference design
Xilinx XCR3128XL-10VQG100C TechnicalAttributes
-Voltage Supply – Internal 3V ~ 3.6V
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Operating Temperature 0℃ ~ 70℃ (TA)
-Delay Time tpd(1) Max 9.1ns
-Number of Macrocells 128
-Mounting Type Surface Mount
-Package / Case 100-TQFP
-Number of Logic Elements/Blocks 8
-Number of I/O 84
-Supplier Device Package 100-VQFP (14×14)
-Number of Gates 3000
