XCR3384XL-7FTG256C ApplicationField
-5G Technology
-Cloud Computing
-Internet of Things
-Artificial Intelligence
-Consumer Electronics
-Industrial Control
-Wireless Technology
-Medical Equipment
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XCR3384XL-7FTG256C FAQ Chips
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ICs XCR3384XL-7FTG256C Features
Supports hot-plugging capability
Advanced 0.35μ five layer metal EEPROM process
Innovative CoolRunner XPLA3 architecture combines high speed with extreme flexibility
Input register setup time of 2.5 ns
100% routable
3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
16 product term clocks and four local control term clocks per function block
5V tolerant I/O pins
Foldback NAND for synthesis optimization
Universal 3-state which facilitates “bed of nails” testing
High-speed pin-to-pin delays of 5.0 ns
Single pass logic expandable to 48 product terms
Security bit prevents unauthorized access
Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
Four global clocks and one universal control term clock per device
Four output enable controls per function block
Excellent pin retention during design changes
Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
Support for complex asynchronous clocking
Typical Standby Current of 17 to 18 μA at 25°C
Slew rate control per output
Design entry/verification using Xilinx or industry standard CAE tools
Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.
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Xilinx XCR3384XL-7FTG256C Overview
The XCR3384XL-7FTG256C is targeted for low power systems that include portable, handheld, and power sensitive applications.，includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the XCR3384XL-7FTG256C offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for “turbo bits” or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. XCR3384XL-7FTG256C devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.CoolRunner XPLA3 CPLDs are supported by Xilinx WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.The XCR3384XL-7FTG256C is electrically reprogrammable using industry standard device programmers.
The Xilinx CPLDs (Complex Programmable Logic Devices) series XCR3384XL-7FTG256C is IC CPLD 384MC 7NS 256BGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCR3384XL-7FTG256C Tags integrated circuit
1. Macrocell CPLD starter kit
2. Xilinx XCR3384XL
3. XCR3384XL development board
4. Macrocell CPLD XCR3384XL
5. XCR3384XL reference design
6. Macrocell CPLD evaluation kit
7. XCR3384XL evaluation board
8. Xilinx Macrocell CPLD development board
9. Macrocell CPLD XCR3384XL
Xilinx XCR3384XL-7FTG256C TechnicalAttributes
-Number of Gates 9000
-Voltage Supply – Internal 3V ~ 3.6V
-Number of Macrocells 384
-Delay Time tpd(1) Max 7.0ns
-Supplier Device Package 256-FTBGA (17×17)
-Mounting Type Surface Mount
-Number of I/O 212
-Number of Logic Elements/Blocks 24
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Operating Temperature 0℃ ~ 70℃ (TA)
-Package / Case 256-LBGA
