XCR3512XL-10FG324C ApplicationField
-Wireless Technology
-Industrial Control
-5G Technology
-Consumer Electronics
-Artificial Intelligence
-Medical Equipment
-Cloud Computing
-Internet of Things
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XCR3512XL-10FG324C FAQ Chips
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ICs XCR3512XL-10FG324C Features
5V tolerant I/O pins
Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.
Innovative CoolRunner XPLA3 architecture combines high speed with extreme flexibility
1,000 erase/program cycles guaranteed
20 years data retention guaranteed
Full Boundary-Scan Test (IEEE 1149.1)
Four output enable controls per function block
Fast programming times
Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
Advanced 0.35μ five layer metal EEPROM process
Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
16 product term clocks and four local control term clocks per function block
Foldback NAND for synthesis optimization
Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
Support for complex asynchronous clocking
Four global clocks and one universal control term clock per device
Excellent pin retention during design changes
Universal 3-state which facilitates “bed of nails” testing
Typical Standby Current of 17 to 18 μA at 25°C
3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
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Xilinx XCR3512XL-10FG324C Overview
The XCR3512XL-10FG324C is targeted for low power systems that include portable, handheld, and power sensitive applications.，includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the XCR3512XL-10FG324C offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for “turbo bits” or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. XCR3512XL-10FG324C devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.CoolRunner XPLA3 CPLDs are supported by Xilinx WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.The XCR3512XL-10FG324C is electrically reprogrammable using industry standard device programmers.
The Xilinx Programmable logic array series XCR3512XL-10FG324C is XCR3512XL: 512 Macrocell CPLD, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCR3512XL-10FG324C Tags integrated circuit
1. XCR3512XL development board
2. XCR3512XL-10FG324C Datasheet PDF
3. Xilinx Macrocell CPLD development board
4. Xilinx XCR3512XL
5. Macrocell CPLD starter kit
6. XCR3512XL reference design
7. XCR3512XL evaluation board
8. Macrocell CPLD evaluation kit
9. Xilinx XCR3512XL
Xilinx XCR3512XL-10FG324C TechnicalAttributes
-Delay Time tpd(1) Max 9.0ns
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Supplier Device Package 324-FBGA (23×23)
-Operating Temperature 0℃ ~ 70℃ (TA)
-Number of Logic Elements/Blocks 32
-Number of Macrocells 512
-Number of I/O 260
-Package / Case 324-BBGA
-Number of Gates 12000
-Mounting Type Surface Mount
-Voltage Supply – Internal 3V ~ 3.6V
