XCR3512XL-10FGG324I ApplicationField
-5G Technology
-Industrial Control
-Cloud Computing
-Artificial Intelligence
-Consumer Electronics
-Internet of Things
-Wireless Technology
-Medical Equipment
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XCR3512XL-10FGG324I FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
ICs XCR3512XL-10FGG324I Features
Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
Full Boundary-Scan Test (IEEE 1149.1)
Innovative CoolRunner XPLA3 architecture combines high speed with extreme flexibility
Support for complex asynchronous clocking
Four output enable controls per function block
1,000 erase/program cycles guaranteed
16 product term clocks and four local control term clocks per function block
3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
Typical Standby Current of 17 to 18 μA at 25°C
Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.
Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
Four global clocks and one universal control term clock per device
Fast programming times
Advanced 0.35μ five layer metal EEPROM process
Excellent pin retention during design changes
20 years data retention guaranteed
Foldback NAND for synthesis optimization
Universal 3-state which facilitates “bed of nails” testing
5V tolerant I/O pins
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Xilinx XCR3512XL-10FGG324I Overview
The XCR3512XL-10FGG324I is targeted for low power systems that include portable, handheld, and power sensitive applications.，includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the XCR3512XL-10FGG324I offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for “turbo bits” or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. XCR3512XL-10FGG324I devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.CoolRunner XPLA3 CPLDs are supported by Xilinx WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.The XCR3512XL-10FGG324I is electrically reprogrammable using industry standard device programmers.
The Xilinx CPLDs series XCR3512XL-10FGG324I is XCR3512XL-10FGG324I – NEW PRODUCT, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XCR3512XL-10FGG324I Tags integrated circuit
1. XCR3512XL evaluation board
2. Macrocell CPLD evaluation kit
3. Xilinx XCR3512XL
4. XCR3512XL development board
5. Macrocell CPLD XCR3512XL
6. Xilinx Macrocell CPLD development board
7. Macrocell CPLD starter kit
8. XCR3512XL reference design
9. XCR3512XL development board
Xilinx XCR3512XL-10FGG324I TechnicalAttributes
-Mounting Type Surface Mount
-Voltage Supply – Internal 2.7V ~ 3.6V
-Number of Gates 12000
-Number of I/O 260
-Number of Macrocells 512
-Package / Case 324-BBGA
-Delay Time tpd(1) Max 9.0ns
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Number of Logic Elements/Blocks 32
-Supplier Device Package 324-FBGA (23×23)
-Operating Temperature -40℃ ~ 85℃ (TA)
