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XCR3512XL-10FTG256C FAQ Chips
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ICs XCR3512XL-10FTG256C Features
Advanced 0.35μ five layer metal EEPROM process
Innovative CoolRunner XPLA3 architecture combines high speed with extreme flexibility
16 product term clocks and four local control term clocks per function block
Fast programming times
20 years data retention guaranteed
Four global clocks and one universal control term clock per device
Full Boundary-Scan Test (IEEE 1149.1)
Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
Four output enable controls per function block
Universal 3-state which facilitates “bed of nails” testing
3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
Support for complex asynchronous clocking
Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
1,000 erase/program cycles guaranteed
Foldback NAND for synthesis optimization
Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.
Excellent pin retention during design changes
5V tolerant I/O pins
Typical Standby Current of 17 to 18 μA at 25°C
Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
Request XCR3512XL-10FTG256C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XCR3512XL-10FTG256C Overview
The XCR3512XL-10FTG256C is targeted for low power systems that include portable, handheld, and power sensitive applications.，includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the XCR3512XL-10FTG256C offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for “turbo bits” or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. XCR3512XL-10FTG256C devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.CoolRunner XPLA3 CPLDs are supported by Xilinx WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.The XCR3512XL-10FTG256C is electrically reprogrammable using industry standard device programmers.
The Xilinx CPLDs series XCR3512XL-10FTG256C is CPLD CoolRunner XPLA3 Family 12K Gates 512 Macro Cells 97MHz 0.35um (CMOS) Technology 3.3V 256Pin FTBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
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XCR3512XL-10FTG256C Tags integrated circuit
1. Macrocell CPLD evaluation kit
2. Macrocell CPLD XCR3512XL
3. XCR3512XL-10FTG256C Datasheet PDF
4. Xilinx XCR3512XL
5. XCR3512XL evaluation board
6. XCR3512XL reference design
7. Macrocell CPLD starter kit
8. Xilinx Macrocell CPLD development board
9. Xilinx XCR3512XL
Xilinx XCR3512XL-10FTG256C TechnicalAttributes
-Package / Case 256-LBGA
-Voltage Supply – Internal 3V ~ 3.6V
-Delay Time tpd(1) Max 9.0ns
-Operating Temperature 0℃ ~ 70℃ (TA)
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Number of Gates 12000
-Supplier Device Package 256-FTBGA (17×17)
-Number of I/O 212
-Mounting Type Surface Mount
-Number of Macrocells 512
-Number of Logic Elements/Blocks 32