XCR3512XL-12FT256I ApplicationField
-Internet of Things
-Cloud Computing
-Artificial Intelligence
-Consumer Electronics
-Medical Equipment
-Wireless Technology
-5G Technology
-Industrial Control
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XCR3512XL-12FT256I FAQ Chips
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs XCR3512XL-12FT256I Features
Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
5V tolerant I/O pins
Innovative CoolRunner XPLA3 architecture combines high speed with extreme flexibility
Support for complex asynchronous clocking
Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
Four global clocks and one universal control term clock per device
Excellent pin retention during design changes
Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.
Fast programming times
3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
Advanced 0.35μ five layer metal EEPROM process
Typical Standby Current of 17 to 18 μA at 25°C
1,000 erase/program cycles guaranteed
Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
Universal 3-state which facilitates “bed of nails” testing
Four output enable controls per function block
Foldback NAND for synthesis optimization
Full Boundary-Scan Test (IEEE 1149.1)
20 years data retention guaranteed
16 product term clocks and four local control term clocks per function block
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Xilinx XCR3512XL-12FT256I Overview
The XCR3512XL-12FT256I is targeted for low power systems that include portable, handheld, and power sensitive applications.，includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the XCR3512XL-12FT256I offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for “turbo bits” or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. XCR3512XL-12FT256I devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.CoolRunner XPLA3 CPLDs are supported by Xilinx WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.The XCR3512XL-12FT256I is electrically reprogrammable using industry standard device programmers.
The Xilinx CPLDs series XCR3512XL-12FT256I is XCR3512XL: 512 Macrocell CPLD, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCR3512XL-12FT256I Tags integrated circuit
1. XCR3512XL evaluation board
2. Macrocell CPLD starter kit
3. XCR3512XL reference design
4. XCR3512XL-12FT256I Datasheet PDF
5. Macrocell CPLD XCR3512XL
6. XCR3512XL development board
7. Macrocell CPLD evaluation kit
8. Xilinx XCR3512XL
9. XCR3512XL-12FT256I Datasheet PDF
Xilinx XCR3512XL-12FT256I TechnicalAttributes
-Supplier Device Package 256-FTBGA (17×17)
-Number of Macrocells 512
-Number of Logic Elements/Blocks 32
-Voltage Supply – Internal 2.7V ~ 3.6V
-Number of I/O 212
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Operating Temperature -40℃ ~ 85℃ (TA)
-Mounting Type Surface Mount
-Delay Time tpd(1) Max 10.8ns
-Package / Case 256-LBGA
-Number of Gates 12000
