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XCR3512XL-7PQG208C FAQ Chips
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ICs XCR3512XL-7PQG208C Features
Based on industry`s first TotalCMOS PLD — both CMOS design and process technologies
Excellent pin retention during design changes
Fast Zero Power (FZP) design technique provides ultra-low power and very high speed
Fast programming times
Advanced 0.35μ five layer metal EEPROM process
16 product term clocks and four local control term clocks per function block
3V, In-System Programmable (ISP) using JTAG IEEE 1149.1 interface
20 years data retention guaranteed
Available in Chip-scale BGA, Fineline BGA, and QFP packages. Pb-free available for most package types. See Xilinx Packaging for more information.
5V tolerant I/O pins
Typical Standby Current of 17 to 18 μA at 25°C
Full Boundary-Scan Test (IEEE 1149.1)
Available in commercial grade and extended voltage (2.7V to 3.6V) industrial grade
Universal 3-state which facilitates “bed of nails” testing
Foldback NAND for synthesis optimization
Innovative CoolRunner XPLA3 architecture combines high speed with extreme flexibility
Four global clocks and one universal control term clock per device
Four output enable controls per function block
Support for complex asynchronous clocking
1,000 erase/program cycles guaranteed
Request XCR3512XL-7PQG208C FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XCR3512XL-7PQG208C Overview
The XCR3512XL-7PQG208C is targeted for low power systems that include portable, handheld, and power sensitive applications.，includes Fast Zero Power (FZP) design technology that combines low power and high speed. With this design technique, the XCR3512XL-7PQG208C offers true pin-to-pin speeds of 5.0 ns, while simultaneously delivering power that is less than 56 μW at standby without the need for “turbo bits” or other power down schemes. By replacing conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates, the dynamic power is also substantially lower than any other CPLD. XCR3512XL-7PQG208C devices are the only TotalCMOS PLDs, as they use both a CMOS process technology and the patented full CMOS FZP design technique. The FZP design technique combines fast nonvolatile memory cells with ultra-low power SRAM shadow memory to deliver the industry’s lowest power 3.3V CPLD family.CoolRunner XPLA3 CPLDs are supported by Xilinx WebPACK software and industry standard CAE tools (Mentor, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, and Synplicity), using HDL editors with ABEL, VHDL, and Verilog, and/or schematic capture design entry. Design verification uses industry standard simulators for functional and timing simulation. Development is supported on multiple personal computer (PC), Sun, and HP platforms.The XCR3512XL-7PQG208C is electrically reprogrammable using industry standard device programmers.
The Xilinx CPLDs series XCR3512XL-7PQG208C is CPLD CoolRunner XPLA3 Family 12K Gates 512 Macro Cells 135MHz 0.35um (CMOS) Technology 3.3V 208Pin PQFP, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCR3512XL-7PQG208C Tags integrated circuit
1. XCR3512XL-7PQG208C Datasheet PDF
2. Macrocell CPLD XCR3512XL
3. XCR3512XL development board
4. Xilinx Macrocell CPLD development board
5. Macrocell CPLD evaluation kit
6. Macrocell CPLD starter kit
7. XCR3512XL reference design
8. Xilinx XCR3512XL
9. Xilinx Macrocell CPLD development board
Xilinx XCR3512XL-7PQG208C TechnicalAttributes
-Number of Gates 12000
-Operating Temperature 0℃ ~ 70℃ (TA)
-Mounting Type Surface Mount
-Number of I/O 180
-Number of Logic Elements/Blocks 32
-Number of Macrocells 512
-Programmable Type In System Programmable (min 1K program/erase cycles)
-Package / Case 208-BFQFP
-Supplier Device Package 208-PQFP (28×28)
-Voltage Supply – Internal 3V ~ 3.6V
-Delay Time tpd(1) Max 7.0ns