XCV200E-7PQ240I ApplicationField
-Industrial Control
-Cloud Computing
-Medical Equipment
-Wireless Technology
-Internet of Things
-Artificial Intelligence
-Consumer Electronics
-5G Technology
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XCV200E-7PQ240I FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Where can I purchase Xilinx XCV200E Development Boards, Evaluation Boards, or Virtex-E 1.8V FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs XCV200E-7PQ240I Features
RF Data Converter Subsystem Overview
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Xilinx XCV200E-7PQ240I Overview
Description
The Virtex-E FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. These advances make Virtex-E FPGAs powerful and flexible alternatives to mask-programmed gate arrays. The Virtex-E family includes the nine members in Table 1.
Building on experience gained from Virtex FPGAs, the Virtex-E family is an evolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the Virtex-E family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
Features
• Fast, High-Density 1.8 V FPGA Family
– Densities from 58 k to 4 M system gates
– 130 MHz internal performance (four LUT levels)
– Designed for low-power operation
– PCI compliant 3.3 V, 32/64-bit, 33/ 66-MHz
• Highly Flexible SelectI/O+™ Technology
– Supports 20 high-performance interface standards
– Up to 804 singled-ended I/Os or 344 differential I/O pairs for an aggregate bandwidth of > 100 Gb/s
• Differential Signalling Support
– LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL
– Differential I/O signals can be input, output, or I/O
– Compatible with standard differential devices
– LVPECL and LVDS clock inputs for 300+ MHz clocks
• Proprietary High-Performance SelectLink™ Technology
– Double Data Rate (DDR) to Virtex-E link
– Web-based HDL generation methodology
• Sophisticated SelectRAM+™ Memory Hierarchy
– 1 Mb of internal configurable distributed RAM
– Up to 832 Kb of synchronous internal block RAM
– True Dual-Port BlockRAM capability
– Memory bandwidth up to 1.66 Tb/s (equivalent bandwidth of over 100 RAMBUS channels)
– Designed for high-performance Interfaces to External Memories
– 200 MHz ZBT* SRAMs
– 200 Mb/s DDR SDRAMs
– Supported by free Synthesizable reference design
• High-Performance Built-In Clock Management Circuitry
– Eight fully digital Delay-Locked Loops (DLLs)
– Digitally-Synthesized 50% duty cycle for Double Data Rate (DDR) Applications
– Clock Multiply and Divide
– Zero-delay conversion of high-speed LVPECL/LVDS clocks to any I/O standard
• Flexible Architecture Balances Speed and Density
– Dedicated carry logic for high-speed arithmetic
– Dedicated multiplier support
– Cascade chain for wide-input function
– Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
– Internal 3-state bussing
– IEEE 1149.1 boundary-scan logic
– Die-temperature sensor diode
• Supported by Xilinx Foundation™ and Alliance Series™ Development Systems
– Further compile time reduction of 50%
– Internet Team Design (ITD) tool ideal for million-plus gate density designs
– Wide selection of PC and workstation platforms
• SRAM-Based In-System Configuration
– Unlimited re-programmability
• Advanced Packaging Options
– 0.8 mm Chip-scale
– 1.0 mm BGA
– 1.27 mm BGA
– HQ/PQ
• 0.18 μm 6-Layer Metal Process
• 100% Factory Tested
The Xilinx Condensateurs céramiques series XCV200E-7PQ240I is Virtex-E 1.8 V Field Programmable Gate Arrays, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCV200E-7PQ240I Tags integrated circuit
1. Virtex-E 1.8V FPGAs starter kit
2. Virtex-E 1.8V FPGAs XCV200E
3. Xilinx Virtex-E 1.8V FPGAs development board
4. Xilinx XCV200E
5. XCV200E-7PQ240I Datasheet PDF
6. XCV200E reference design
7. XCV200E evaluation board
8. XCV200E development board
9. Xilinx XCV200E
Xilinx XCV200E-7PQ240I TechnicalAttributes
-Mounting Type Surface Mount
-Number of Logic Elements/Cells 5292
-Package / Case 240-BFQFP
-Operating Temperature -40℃ ~ 100℃ (TJ)
-Voltage – Supply 1.71V ~ 1.89V
-Number of I/O 158
-Number of Gates 306393
-Total RAM Bits 114688
-Supplier Device Package 240-PQFP (32×32)
-Number of LABs/CLBs 1176
