XCV812E-6BG560C ApplicationField
-Artificial Intelligence
-Wireless Technology
-5G Technology
-Industrial Control
-Internet of Things
-Cloud Computing
-Medical Equipment
-Consumer Electronics
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XCV812E-6BG560C FAQ Chips
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
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ICs XCV812E-6BG560C Features
RF Data Converter Subsystem Overview
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Xilinx XCV812E-6BG560C Overview
The XCV812E-6BG560C delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. the XCV812E-6BG560C delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
The Xilinx Rangée de condensateur series XCV812E-6BG560C is Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays FPGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCV812E-6BG560C Tags integrated circuit
1. XCV812E evaluation board
2. XCV812E reference design
3. Virtex-EM 1.8V FPGAs evaluation kit
4. Xilinx XCV812E
5. Virtex-EM 1.8V FPGAs starter kit
6. Virtex-EM 1.8V FPGAs XCV812E
7. XCV812E-6BG560C Datasheet PDF
8. XCV812E development board
9. Xilinx XCV812E
Xilinx XCV812E-6BG560C TechnicalAttributes
-Voltage – Supply 1.71V ~ 1.89V
-Supplier Device Package 560-MBGA (42.5×42.5)
-Number of LABs/CLBs 4704
-Number of Gates 254016
-Number of I/O 404
-Mounting Type Surface Mount
-Operating Temperature 0℃ ~ 85℃ (TJ)
-Number of Logic Elements/Cells 21168
-Total RAM Bits 1146880
-Package / Case 560-LBGA Exposed Pad, Metal
