XCV812E-FG900AFS ApplicationField
-Internet of Things
-5G Technology
-Industrial Control
-Wireless Technology
-Cloud Computing
-Medical Equipment
-Consumer Electronics
-Artificial Intelligence
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XCV812E-FG900AFS FAQ Chips
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ICs XCV812E-FG900AFS Features
RF Data Converter Subsystem Overview
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Xilinx XCV812E-FG900AFS Overview
The XCV812E-FG900AFS delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 μm CMOS process. the XCV812E-FG900AFS delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
XCV812E-FG900AFS Tags integrated circuit
1. XCV812E reference design
2. XCV812E evaluation board
3. Xilinx Virtex-EM 1.8V FPGAs development board
4. XCV812E-FG900AFS Datasheet PDF
5. Xilinx XCV812E
6. Virtex-EM 1.8V FPGAs starter kit
7. Virtex-EM 1.8V FPGAs XCV812E
8. XCV812E development board
9. XCV812E-FG900AFS Datasheet PDF
Xilinx XCV812E-FG900AFS TechnicalAttributes