XCVU080-H1FFVB1760E ApplicationField
-Medical Equipment
-Wireless Technology
-5G Technology
-Consumer Electronics
-Artificial Intelligence
-Cloud Computing
-Internet of Things
-Industrial Control
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XCVU080-H1FFVB1760E FAQ Chips
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: How to obtain XCVU080-H1FFVB1760E technical support documents?
A: Enter the “XCVU080-H1FFVB1760E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XCVU080-H1FFVB1760E pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.
Q: Where can I purchase Xilinx XCVU080 Development Boards, Evaluation Boards, or Virtex UltraScale FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: Does the price of XCVU080-H1FFVB1760E devices fluctuate frequently?
A: The RAYPCB search engine monitors the XCVU080-H1FFVB1760E inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
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ICs XCVU080-H1FFVB1760E Features
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Xilinx XCVU080-H1FFVB1760E Overview
Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.Kintex UltraScale XCVU080-H1FFVB1760E FPGAs: XCVU080-H1FFVB1760E FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.Kintex UltraScale+ FPGAs: Based on the UltraScale architecture, these XCVU080-H1FFVB1760E devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.Virtex UltraScale+ FPGAs: Based on the UltraScale architecture, these devices have the highest transceiver bandwidth, highest DSP count, and highest on-chip memory available in the industry for the ultimate in system performance. In addition, Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.the XCVU080-H1FFVB1760E provide unprecedented power savings, processing, programmable acceleration, I/O, and memory bandwidth ideal for applications that require heterogeneous processing.
XCVU080-H1FFVB1760E Tags integrated circuit
1. Xilinx XCVU080
2. Xilinx Virtex UltraScale FPGA development board
3. XCVU080-H1FFVB1760E Datasheet PDF
4. Virtex UltraScale FPGA evaluation kit
5. Virtex UltraScale FPGA starter kit
6. XCVU080 reference design
7. XCVU080 development board
8. XCVU080 evaluation board
9. Virtex UltraScale FPGA evaluation kit
Xilinx XCVU080-H1FFVB1760E TechnicalAttributes
-Number of I/O 702
-Number of Logic Elements/Cells 975000
-Number of LABs/CLBs 55714
-Supplier Device Package 1760-FCBGA (42.5×42.5)
-Voltage – Supply 0.922V ~ 1.030V
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Package / Case 1760-BBGA, FCBGA
-Total RAM Bits 51200000
-Mounting Type Surface Mount