XCVU125-3FLVB1760E ApplicationField
-5G Technology
-Internet of Things
-Industrial Control
-Consumer Electronics
-Medical Equipment
-Wireless Technology
-Cloud Computing
-Artificial Intelligence
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XCVU125-3FLVB1760E FAQ Chips
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Q: How to obtain XCVU125-3FLVB1760E technical support documents?
A: Enter the “XCVU125-3FLVB1760E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
ICs XCVU125-3FLVB1760E Features
Processing System
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Xilinx XCVU125-3FLVB1760E Overview
Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.Kintex UltraScale XCVU125-3FLVB1760E FPGAs: XCVU125-3FLVB1760E FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.Kintex UltraScale+ FPGAs: Based on the UltraScale architecture, these XCVU125-3FLVB1760E devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.Virtex UltraScale+ FPGAs: Based on the UltraScale architecture, these devices have the highest transceiver bandwidth, highest DSP count, and highest on-chip memory available in the industry for the ultimate in system performance. In addition, Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.the XCVU125-3FLVB1760E provide unprecedented power savings, processing, programmable acceleration, I/O, and memory bandwidth ideal for applications that require heterogeneous processing.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XCVU125-3FLVB1760E is Virtex UltraScale FPGA 702 I/O 1760FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCVU125-3FLVB1760E Tags integrated circuit
1. XCVU125 reference design
2. XCVU125 development board
3. Virtex UltraScale FPGA XCVU125
4. XCVU125 evaluation board
5. Xilinx Virtex UltraScale FPGA development board
6. XCVU125-3FLVB1760E Datasheet PDF
7. Xilinx XCVU125
8. Virtex UltraScale FPGA starter kit
9. XCVU125 evaluation board
Xilinx XCVU125-3FLVB1760E TechnicalAttributes
-Supplier Device Package 1760-FCBGA (42.5×42.5)
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Mounting Type Surface Mount
-Number of I/O 702
-Total RAM Bits 90726400
-Number of Logic Elements/Cells 1566600
-Number of LABs/CLBs 89520
-Voltage – Supply 0.970V ~ 1.030V
-Package / Case 1760-BBGA, FCBGA