XCVU160-2FLGC2104I -Internet of Things -Consumer Electronics

XCVU160-2FLGC2104I ApplicationField

-Cloud Computing
-Industrial Control
-Medical Equipment
-5G Technology
-Artificial Intelligence
-Consumer Electronics
-Wireless Technology
-Internet of Things

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XCVU160-2FLGC2104I FAQ Chips 

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A: Enter the “XCVU160-2FLGC2104I” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .

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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

Q: Where can I purchase Xilinx XCVU160 Development Boards, Evaluation Boards, or Virtex UltraScale FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XCVU160-2FLGC2104I pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.

ICs XCVU160-2FLGC2104I Features

Processing System

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Xilinx XCVU160-2FLGC2104I Overview

Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.Kintex UltraScale XCVU160-2FLGC2104I FPGAs: XCVU160-2FLGC2104I FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.Kintex UltraScale+ FPGAs: Based on the UltraScale architecture, these XCVU160-2FLGC2104I devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.Virtex UltraScale+ FPGAs: Based on the UltraScale architecture, these devices have the highest transceiver bandwidth, highest DSP count, and highest on-chip memory available in the industry for the ultimate in system performance. In addition, Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.the XCVU160-2FLGC2104I provide unprecedented power savings, processing, programmable acceleration, I/O, and memory bandwidth ideal for applications that require heterogeneous processing.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XCVU160-2FLGC2104I is Virtex UltraScale FPGA 416 I/O 2104FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.

XCVU160-2FLGC2104I Tags integrated circuit

1. Xilinx Virtex UltraScale FPGA development board
2. XCVU160-2FLGC2104I Datasheet PDF
3. XCVU160 evaluation board
4. Virtex UltraScale FPGA evaluation kit
5. XCVU160 reference design
6. Virtex UltraScale FPGA starter kit
7. Xilinx XCVU160
8. Virtex UltraScale FPGA XCVU160
9. Virtex UltraScale FPGA evaluation kit

Xilinx XCVU160-2FLGC2104I TechnicalAttributes

-Operating Temperature -40℃ ~ 100℃ (TJ)
-Number of I/O 416
-Total RAM Bits 130969600
-Number of LABs/CLBs 115800
-Package / Case 2104-BBGA, FCBGA
-Voltage – Supply 0.922V ~ 0.979V
-Supplier Device Package 2104-FCBGA (47.5×47.5)

-Number of Logic Elements/Cells 2026500
-Mounting Type Surface Mount

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