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XCVU160-3FLGB2104E FAQ Chips
Q: What should I do if I did not receive the technical support for XCVU1603FLGB2104E in time?
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Q: How to obtain XCVU160-3FLGB2104E technical support documents?
A: Enter the “XCVU160-3FLGB2104E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
Q: Does the price of XCVU160-3FLGB2104E devices fluctuate frequently?
A: The RAYPCB search engine monitors the XCVU160-3FLGB2104E inventory quantity and price of global electronic component suppliers in real time, and regularly records historical price data. You can view the historical price trends of electronic components to provide a basis for your purchasing decisions.
Q: Where can I purchase Xilinx XCVU160 Development Boards, Evaluation Boards, or Virtex UltraScale FPGA Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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ICs XCVU160-3FLGB2104E Features
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Xilinx XCVU160-3FLGB2104E Overview
Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.Kintex UltraScale XCVU160-3FLGB2104E FPGAs: XCVU160-3FLGB2104E FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.Kintex UltraScale+ FPGAs: Based on the UltraScale architecture, these XCVU160-3FLGB2104E devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.Virtex UltraScale+ FPGAs: Based on the UltraScale architecture, these devices have the highest transceiver bandwidth, highest DSP count, and highest on-chip memory available in the industry for the ultimate in system performance. In addition, Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.the XCVU160-3FLGB2104E provide unprecedented power savings, processing, programmable acceleration, I/O, and memory bandwidth ideal for applications that require heterogeneous processing.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XCVU160-3FLGB2104E is Virtex UltraScale FPGA 702 I/O 2104FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCVU160-3FLGB2104E Tags integrated circuit
1. XCVU160 reference design
2. XCVU160-3FLGB2104E Datasheet PDF
3. XCVU160 development board
4. Xilinx XCVU160
5. XCVU160 evaluation board
6. Virtex UltraScale FPGA XCVU160
7. Xilinx Virtex UltraScale FPGA development board
8. Virtex UltraScale FPGA starter kit
9. Xilinx XCVU160
Xilinx XCVU160-3FLGB2104E TechnicalAttributes
-Voltage – Supply 0.970V ~ 1.030V
-Number of Logic Elements/Cells 2026500
-Number of LABs/CLBs 115800
-Package / Case 2104-BBGA, FCBGA
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Mounting Type Surface Mount
-Total RAM Bits 130969600
-Supplier Device Package 2104-FCBGA (47.5×47.5)
-Number of I/O 702