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XCVU190-3FLGA2577E FAQ Chips
Q: Does the price of XCVU190-3FLGA2577E devices fluctuate frequently?
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A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
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Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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A: Depending on the time difference between your location and our location, it may take several hours for us to reply, please be patient, our FPGA technical engineer will help you with the XCVU190-3FLGA2577E pinout information, replacement, datasheet in pdf, programming tools, starter kit, etc.
Q: How to obtain XCVU190-3FLGA2577E technical support documents?
A: Enter the “XCVU190-3FLGA2577E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
ICs XCVU190-3FLGA2577E Features
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Xilinx XCVU190-3FLGA2577E Overview
Xilinx UltraScale architecture comprises high-performance FPGA and MPSoC families that address a vast spectrum of system requirements with a focus on lowering total power consumption through numerous innovative technological advancements.Kintex UltraScale XCVU190-3FLGA2577E FPGAs: XCVU190-3FLGA2577E FPGAs with a focus on price/performance, using both monolithic and next-generation stacked silicon interconnect (SSI) technology. High DSP and block RAM-to-logic ratios and next-generation transceivers, combined with low-cost packaging, enable an optimum blend of capability and cost.Kintex UltraScale+ FPGAs: Based on the UltraScale architecture, these XCVU190-3FLGA2577E devices have increased performance and on-chip UltraRAM memory to reduce BOM cost, providing the ideal mix of high-performance peripherals and cost-effective system implementation. In addition, Kintex UltraScale+ FPGAs have numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.Virtex UltraScale+ FPGAs: Based on the UltraScale architecture, these devices have the highest transceiver bandwidth, highest DSP count, and highest on-chip memory available in the industry for the ultimate in system performance. In addition, Virtex UltraScale+ FPGAs also provide numerous power options that deliver the optimal balance between the required system performance and the smallest power envelope.the XCVU190-3FLGA2577E provide unprecedented power savings, processing, programmable acceleration, I/O, and memory bandwidth ideal for applications that require heterogeneous processing.
The Xilinx Embedded – FPGAs (Field Programmable Gate Array) series XCVU190-3FLGA2577E is Virtex UltraScale FPGA 448 I/O 2577FCBGA, View Substitutes & Alternatives along with datasheets, stock, pricing from Authorized Distributors at RAYPCB.com,
and you can also search for other FPGAs products.
XCVU190-3FLGA2577E Tags integrated circuit
1. Xilinx Virtex UltraScale FPGA development board
2. Virtex UltraScale FPGA evaluation kit
3. XCVU190-3FLGA2577E Datasheet PDF
4. Xilinx XCVU190
5. Virtex UltraScale FPGA starter kit
6. Virtex UltraScale FPGA XCVU190
7. XCVU190 evaluation board
8. XCVU190 reference design
9. Xilinx XCVU190
Xilinx XCVU190-3FLGA2577E TechnicalAttributes
-Number of LABs/CLBs 134280
-Number of Logic Elements/Cells 2349900
-Package / Case 2577-BBGA, FCBGA
-Number of I/O 448
-Voltage – Supply 0.970V ~ 1.030V
-Supplier Device Package 2577-FCBGA (52.5×52.5)
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Total RAM Bits 150937600
-Mounting Type Surface Mount