XCZU6EG-1FFVB1156I -Internet of Things -Industrial Control

XCZU6EG-1FFVB1156I ApplicationField

-Medical Equipment
-Cloud Computing
-Artificial Intelligence
-5G Technology
-Wireless Technology
-Industrial Control
-Consumer Electronics
-Internet of Things

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Q: Where can I purchase Xilinx XCZU6EG Development Boards, Evaluation Boards, or Zynq UltraScale+ MPSoC Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.

Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.

ICs XCZU6EG-1FFVB1156I Features

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Xilinx XCZU6EG-1FFVB1156I Overview

The Xilinx XCZU6EG-1FFVB1156I are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. DC and AC characteristics are specified in extended (E), industrial (I), automotive (Q), and military (M) temperature ranges.

XCZU6EG-1FFVB1156I Tags integrated circuit

1. Zynq UltraScale+ MPSoC XCZU6EG
2. XCZU6EG development board
3. XCZU6EG reference design
4. XCZU6EG evaluation board
5. Xilinx Zynq UltraScale+ MPSoC development board
6. Zynq UltraScale+ MPSoC starter kit
7. XCZU6EG-1FFVB1156I Datasheet PDF
8. Xilinx XCZU6EG
9. XCZU6EG evaluation board

Xilinx XCZU6EG-1FFVB1156I TechnicalAttributes

-Package / Case 1156-BBGA, FCBGA
-RAM Size 256KB
-Primary Attributes Zynq?UltraScale+? FPGA, 469K+ Logic Cells
-Speed 500MHz, 600MHz, 1.2GHz
-Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
-Architecture MCU, FPGA
-Peripherals DMA, WDT

-Operating Temperature -40℃ ~ 100℃ (TJ)
-Supplier Device Package 1156-FCBGA (35×35)

-Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2

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