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XCZU7EG-2FBVB900E FAQ Chips
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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Q: Does the price of XCZU7EG-2FBVB900E devices fluctuate frequently?
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A: Enter the “XCZU7EG-2FBVB900E” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: Where can I purchase Xilinx XCZU7EG Development Boards, Evaluation Boards, or Zynq UltraScale+ MPSoC Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
ICs XCZU7EG-2FBVB900E Features
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Xilinx XCZU7EG-2FBVB900E Overview
The Xilinx XCZU7EG-2FBVB900E are available in -3, -2, -1 speed grades, with -3E devices having the highest performance. DC and AC characteristics are specified in extended (E), industrial (I), automotive (Q), and military (M) temperature ranges.
XCZU7EG-2FBVB900E Tags integrated circuit
1. Xilinx Zynq UltraScale+ MPSoC development board
2. XCZU7EG-2FBVB900E Datasheet PDF
3. XCZU7EG evaluation board
4. Zynq UltraScale+ MPSoC evaluation kit
5. Xilinx XCZU7EG
6. XCZU7EG development board
7. Zynq UltraScale+ MPSoC starter kit
8. Zynq UltraScale+ MPSoC XCZU7EG
9. Zynq UltraScale+ MPSoC evaluation kit
Xilinx XCZU7EG-2FBVB900E TechnicalAttributes
-Architecture MCU, FPGA
-Primary Attributes Zynq?UltraScale+? FPGA, 504K+ Logic Cells
-Core Processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
-Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
-Package / Case 900-BBGA, FCBGA
-Peripherals DMA, WDT
-Supplier Device Package 900-FCBGA (31×31)
-RAM Size 256KB
-Operating Temperature 0℃ ~ 100℃ (TJ)
-Speed 533MHz, 600MHz, 1.3GHz