XQR4013XL-1CB228I ApplicationField
-Artificial Intelligence
-Internet of Things
-Cloud Computing
-Medical Equipment
-Industrial Control
-Wireless Technology
-Consumer Electronics
-5G Technology
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XQR4013XL-1CB228I FAQ Chips
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A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
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ICs XQR4013XL-1CB228I Features
Highest capacity: over 130,000 usable gates
Processed on Xilinx QML line
Buffered interconnect for maximum speed
Optional multiplexer or 2-input function generator on device outputs
Low power segmented routing architecture
5V tolerant I/Os
New latch capability in configurable logic blocks
Configured by loading binary file
Development system runs on most common computer platforms
Radiation-hardened FPGAs for space and satellite applications
Program verification
Low soft upset rate
Improved VersaRing I/O interconnect for better fixed pinout flexibility
System performance beyond 60 MHz
Fully automatic mapping, placement and routing
Readback capability
Systems-oriented features
Interfaces to popular design environments
Virtually unlimited number of clock signals
Internal node observability
Interactive design editor for design optimization
Unlimited reprogrammability
System featured FPGAs
Guaranteed to meet full electrical specifications over –55°C to +125°C
Available in -3 speed
Flexible array architecture
Latch-up immune
Guaranteed total ionizing dose
Advanced 0.35µ process
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Xilinx XQR4013XL-1CB228I Overview
Power-On Power Supply RequirementsXilinx XQR4013XL-1CB228I FPGAs require a minimum rated power supply current capacity to insure proper initialization, and the power supply ramp-up time does affect the current required. A fast ramp-up time requires more current than a slow ramp-up time. The slowest ramp-up time is 50 ms. Current capacity is not specified for a ramp-up time faster than 2 ms. The current capacity varies linealy with ramp-up time, e.g., an XQR4036XL with a ramp-up time of 25 ms would require a capacity predicted by the point on the straight line drawn from 1A at 120 µs to 500 mA at 50 ms at the 25 ms time mark. This point is approximately 750 mA .XQR4013XL-1CB228I AC Switching CharacteristicTesting of the switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values where one global clock input drives one vertical clock line in each accessible column, and where all accessible IOB and CLB flip-flops are clocked by the global clock net.When fewer vertical clock lines are connected, the clock distribution is faster; when multiple clock lines per column are driven from the same global clock, the delay is longer. For more specific, more precise, and worst-case guaranteed data, reflecting the actual routing structure, use the values provided by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist. These path delays, provided as a guideline, have been extracted from the static timing analyzer report. All timing parameters assume worst-case operating conditions (supply voltage and junction temperature)XQR4013XL-1CB228I CLB Switching Characteristic GuidelinesTesting of switching parameters is modeled after testing methods specified by MIL-M-38510/605. All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values. For more specific, more precise, and worst-case guaranteed data, use the values reported by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotated to the simulation netlist. All timing parameters assume worst-case operating conditions (supply voltage and junction temperature). Values apply to all XQR4000XL devices and expressed in nanoseconds unless otherwise noted.
XQR4013XL-1CB228I Tags integrated circuit
1. QPRO XQR4000XL Radiation Hardened FPGAs starter kit
2. QPRO XQR4000XL Radiation Hardened FPGAs evaluation kit
3. XQR4013XL reference design
4. Xilinx XQR4013XL
5. XQR4013XL-1CB228I Datasheet PDF
6. XQR4013XL evaluation board
7. XQR4013XL development board
8. QPRO XQR4000XL Radiation Hardened FPGAs XQR4013XL
9. Xilinx XQR4013XL
Xilinx XQR4013XL-1CB228I TechnicalAttributes
