XQV1000E-3CG560M ApplicationField
-Consumer Electronics
-5G Technology
-Medical Equipment
-Wireless Technology
-Artificial Intelligence
-Industrial Control
-Cloud Computing
-Internet of Things
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XQV1000E-3CG560M FAQ Chips
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Q: Where can I purchase Xilinx XQV1000E Development Boards, Evaluation Boards, or QPro Virtex-E 1.8V QML High-Reliability FPGAs Starter Kit? also provide technical information?
A: RAYPCB does not provide development board purchase services for the time being, but customers often consult about ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR, Terasic DE10-Nano, Digilent Arty S7, etc. If you need relevant technical information, you can submit feedback information, our technicians will contact you soon.
Q: How to obtain XQV1000E-3CG560M technical support documents?
A: Enter the “XQV1000E-3CG560M” keyword in the search box of the website, or find these through the Download Channel or FPGA Forum .
Q: How can I obtain software development tools related to the Xilinx FPGA platform?
A: In FPGA/CPLD design tools, Xilinx’s Vivado Design Suite is easy to use, it is very user-friendly in synthesis and implementation, and it is easier to use than ISE design tools; The specific choice depends on personal habits and functional requirements to specifically select a more suitable match. You can search and download through the FPGA resource channel.
ICs XQV1000E-3CG560M Features
– Further compile time reduction of 50%
– Double Data Rate (DDR) to Virtex-E link
– 600 Kb of internal configurable distributed RAM
– Unlimited reprogrammability
– Digitally-Synthesized 50% duty cycle for Double Data Rate (DDR) Applications
– Zero-delay conversion of high-speed LVPECL/LVDS clocks to any I/O standard
• Highly Flexible SelectIO+ Technology
– Internet Team Design (ITD) tool ideal for million-plus gate density designs
– 200 MHz ZBT* SRAMs
– Dual port block RAM capability
• Fast, High-Density 1.8V FPGA Family
– Internal 3-state bussing
• High-Performance Built-In Clock Management Circuitry
– Up to 640 Kb of synchronous internal block RAM
– IEEE 1149.1 boundary-scan logic
• Ceramic and Plastic Packages
• Certified to MIL-PRF-38535 (Qualified Manufacturer Listing)
– Dedicated multiplier support
– Wide selection of PC and workstation platforms
– LVDS (622 Mb/s), BLVDS (Bus LVDS), LVPECL
– LVPECL and LVDS clock inputs for 300+ MHz clocks
– Supports 20 high-performance interface standards
– Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
• Flexible Architecture Balances Speed and Density
– Cascade chain for wide-input function
– Supported by free Synthesizable reference design
– Designed for low-power operation
– Web-based HDL generation methodology
• SRAM-Based In-System Configuration
– Up to 804 singled-ended I/Os or 344 differential I/O pairs for an aggregate bandwidth of > 100 Gb/s
– Eight fully digital Delay-Locked Loops (DLLs)
• Differential Signalling Support
• Sophisticated SelectRAM+ Memory Hierarchy
– Dedicated carry logic for high-speed arithmetic
– Compatible with standard differential devices
• Supported by Xilinx Foundation and Alliance Series Development Systems
– Clock Multiply and Divide
– Densities from 600K to 2M system gates
– 200 Mb/s DDR SDRAMs
• Proprietary High-Performance SelectLink Technology
– 130 MHz internal performance (four LUT levels)
• Advanced Packaging Options
– Designed for high-performance Interfaces to External Memories
• Guaranteed over the full military temperature range (–55°C to +125°C)
– Memory bandwidth up to 1.66 Tb/s (equivalent bandwidth of over 100 RAMBUS channels)
– Differential I/O signals can be input, output, or I/O
– Die-temperature sensor diode
– PCI compliant 3.3V, 32-bit, 33 MHz
Request XQV1000E-3CG560M FPGA Quote, Pls Send Email to Sales@hillmancurtis.com Now
Xilinx XQV1000E-3CG560M Overview
The XQV1000E-3CG560M FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 6-layer metal 0.18 µm CMOS process. These advances make Virtex-E FPGAs powerful and flexible alter natives to mask-programmed gate arrays.Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the XQV1000E-3CG560M delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.Virtex-E ArchitectureXQV1000E-3CG560M devices feature a flexible, regular architecture that comprises an array of configurable logic blocks (CLBs) surrounded by programmable input/output blocks (IOBs), all interconnected by a rich hierarchy of fast, versatile routing resources. The abundance of routing resources permits the XQV1000E-3CG560M family to accommodate even the largest and most complex designs.Higher PerformanceXQV1000E-3CG560M devices provide better performance than previous generations of FPGAs. Designs can achieve synchronous system clock rates up to 240 MHz including I/O or 622 Mb/s using Source Synchronous data transmission architechtures. Virtex-E XQV1000E-3CG560M I/Os comply fully with 3.3V PCI specifications, and interfaces can be implemented that operate at 33 MHz or 66 MHz. While performance is design-dependent, many designs operate internally at speeds in excess of 133 MHz and can achieve over 311 MHz.
XQV1000E-3CG560M Tags integrated circuit
1. XQV1000E development board
2. XQV1000E reference design
3. QPro Virtex-E 1.8V QML High-Reliability FPGAs starter kit
4. Xilinx XQV1000E
5. QPro Virtex-E 1.8V QML High-Reliability FPGAs XQV1000E
6. XQV1000E evaluation board
7. QPro Virtex-E 1.8V QML High-Reliability FPGAs evaluation kit
8. XQV1000E-3CG560M Datasheet PDF
9. Xilinx XQV1000E
Xilinx XQV1000E-3CG560M TechnicalAttributes
